Product range along the processing steps
Our wide range of application-oriented instruments, systems and components is used for various processing steps along the entire process chain, offering versatile customer benefit.

For special customer requirements we also developed custom-made products which transgress into the physical and technical limits and move today’s process boundaries constantly new.

Instruments

HP Series: Easy To Bake

SAWATEC AG supplies various hotplates for typical soft bake and hard bake processes in lithography, MEMS and similar applications. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability.

Outstanding features of the manual and semi-automatic hotplates are their robust design and ease of operation. The extensive HP series can be used for wafers from 150 mm up to 900 mm or 12×12 inch substrates.

These instruments are available as portable bench-top, bench-mounted or mobile cabinet units.

Hotplate HP-150

The temperature range of the Hotplate HP-150 is designed for up to 250°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 150 mm and thicknesses of 5 mm at maximum.

The hotplate is covered with safety glass, which makes cleaning easier. Due to the highquality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision, good value instruments are available both as portable bench-top and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Automatic temperature limit switch, no overheating
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing manually controlled, no oxidation
  • Simple setup tool for optimal alignment of the hotplate

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 1°C at 100°C

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Hotplate HP-200

The temperature range of the Hotplate HP-200 is designed for up to 250°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm (load pins in the upper start position) at maximum.

The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • User-friendly process configuration with touch screen panel
  • Quick start/stop functions for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 24 program-steps
  • Proximity as well as loading pins, adaptable to different substrate sizes
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

 

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Simple setup tool for optimal alignment of the hotplate

 

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 0.6°C at 100°C
  • Electrical driven proximity and loading pins (stroke 8 mm)
  • Program controlled adjustable proximity pins (0.1 mm increments)
  • Pin-circle-diameters Ø 45mm (2″) / Ø 92mm (4″) / Ø 142mm (6″) / Ø 192mm (8″)

 

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Hotplate HP-300

The temperature range of the Hotplate HP-300 is designed for up to 250°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 300 mm and thicknesses of 14mm (load pins in the upper start position) at maximum.

The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision Hotplates HP-300 are available as mobile cabinet or bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • User-friendly process configuration with touch screen panel
  • Quick start/stop function for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 24 program-steps
  • Proximity as well as loading pins, can be easily adapted to different substrate sizes
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Simple setup tool for optimal alignment of the hotplate

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 0.8°C at 100°C
  • Electrical driven proximity and loading pins (stroke 8 mm)
  • Program controlled adjustable proximity pins (0.1 mm increments)
  • Pin-circle-diameters Ø 45 – 292 mm (2″ – 12″)

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Hotplate HP-600

The temperature range of the Hotplate HP-600 is designed for up to 200°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with sizes of 200 x 200 mm up to 600 x 600 mm, round or square.

The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision Hotplate HP-300 is available as a mobile cabinet.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Quick start/stop function for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 24 program-steps
  • Proximity as well as loading pins
  • Hotplate with safety glass, easy cleaning
  • User-friendly process configuration with touch screen panel
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Simple setup tool for optimal alignment of the hotplate

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 200°C
  • Temperature accuracy: +/- 1.5°C at 100°C
  • Electrical driven proximity and loading pins
  • Substrate with a weight of max. 10 kg can be processed

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

CP series: controlled cooling

At SAWATEC you can get different coolplates for fast and controlled cooling of flat substrates. The coolplate series avoids long waiting times for cooling the substrates or wafers. If required, the cooling rate can be increased with a chiller.

The manual and semi-automatic coolplates impress with their high-quality design and easy handling. The CP series can be used for wafers from 150 mm to 300 mm or substrates of 200×200 mm.

Coolplates are available as bench-mounted or cabinet version.

Coolplate CP-200

The Coolplate CP-200 was developed for thermal management in the semiconductor and MEMS industry, e.g. for cooling wafers. It can be used for substrates up to Ø 200 mm and thicknesses up to 14 mm or with wafers ranging in size from 50 x 50 to 200 x 200mm, round or square.

Outstanding features of the manual and semi-automatic hotplates are their robust design and ease of operation.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • User-friendly process configuration with touch screen panel
  • Quick start/stop function for repeat processes
  • Automatic temperature limit switch
  • Proximity as well as loading pins, can be easily adapted to different substrate sizes
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of substrates

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Simple setup tool for optimal alignment of the coolplate

PERFORMANCE DATA

  • Temperature range: 5 – 23°C
  • Electrical driven proximity and loading pins
  • Proximity adjustment from 0-1 mm (0.1 mm steps)
  • Substrate size: max. 200 mm (round or square)
  • Coolramp with 24 program steps possible
  • Manual substrate fixation via vacuum

For more details or the documentation please contact our Sales Team via contact form.

 

 

 

Offer/Documentation

SM Series: Coating2

The manual spin modules by SAWATEC are used for substrates with no or very low surface structures.

The user-friendly operation and large range of application-specific chucks facilitate a high degree of flexibility in terms of the substrates that can be used. All commercial photoresists can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm (24 x 24″) substrates.

The SM series is convincing due to its high level of uniformity and repeatability, coupled with easy operation and comfortable handling. In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a comprehensive and good value bowl protector. This bowl protector is easy to remove and dispose of once the process has been completed. Due to the high-quality design, the maintenance effort is minimal. Therefore, the SAWATEC spin
modules are preferentially used for laboratories, R&D, pilot projects and institutes.

The compact SM series is supplied as portable bench-top, bench-mounted or mobile cabinet units.

Spin Module SM-150

The Spin Modules SM-150 are the optimal choice for manual and semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 150 mm  (6 inches) or 127 x 127 mm (5 x 5 inch) substrates. The process chamber is designed for a diameter of up to 176 mm.

The high-precision, good value instruments are available both as portable bench-top and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Manual cover with air flow inlet and sensor lock control
  • Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Semi-automatic cartridge dispensing system, 50 ml glass syringe with manual dispensing arm and recirculation function
  • Manual nitrogen (N2) purge of the process chamber
  • Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  • Bowl assembly made of anodised aluminium
  • Bowl protector made of aluminium or PE
  • Vacuum pump for SM-150 module
  • Wafer alignment tool 2 – 6” (round)

 

PERFORMANCE DATA

  • Speed range: 0 to 10’000 rpm +/-1 rpm
  • Speed acceleration: 0 – 8’000 rpm in 0,8 sec. / 0 – 10’000 rpm in 1 sec. 1)
  • Delay: 10’000 rpm – 0 in 2,5 sec. / 8’000 rpm – 0 in 0,8 sec. 1)
  • Process time up to 2376 seconds
  • Dosing time 99 seconds/segment

1) Depending on the substrate size and spin chuck type

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Spin Module SM-200

The Spin Modules SM-200 are the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 200 mm (8 inches) or 150 x 150mm (6×6 inch) substrates.

The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber, resulting in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.

The high-precision instruments are available both as mobile cabinet and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start/stop function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • RCCT system (Round-Closed-Chamber-Technology)
  • Dynamic dispense arm prepared for up to 4 media lines
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional dispensing lines including precision dosing pumps or syringe
  • Automatic cartridge dispensing system, 50 ml glass syringe CDS-50
  • Top side edge bead removal (EBR circular and linear)
  • Automatic nozzle cleaning including solvent pump
  • Program controlled Filter Fan Unit (FFU)
  • Bowl protection insert for easy and efficient cleaning
  • Wafer alignment tool 1” – 12” (round)

 

PERFORMANCE DATA

  • Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  • Delay: 6’000 – 0 rpm in 0,8 sec.
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Dosing time depends on pump type

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Spin Module SM-300

The Spin Modules SM-300 are the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 300 mm (12 inches) or 200 x 200 mm (8 × 8 inch) substrates.

The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber, resulting in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.

The high-precision instruments are available both as mobile cabinet and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start/stop function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • RCCT system (Round-Closed-Chamber-Technology)
  • Dynamic dispense arm prepared for up to 4 media lines
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional dispensing lines including precision dosing pumps or syringe
  • Automatic cartridge dispensing system, 50 ml glass syringe CDS-50
  • Top side edge bead removal (EBR circular and linear)
  • Automatic nozzle cleaning including solvent pump
  • Program controlled Filter Fan Unit (FFU)
  • Bowl protection insert for easy and efficient cleaning
  • Wafer alignment tool 1 – 12” (round)

PERFORMANCE DATA

  • Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  • Delay: 6’000 – 0 rpm in 0,8 sec.
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Dosing time depends on pump type

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Spin Module SM-600

The Spin Modules SM-600 are the optimal choice for semi-automatic coating of larger substrates. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 600 mm or 16 × 16 inch substrates.

The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber, resulting in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.

The high-precision instruments are available as mobile cabinet units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • RCCT system (Round-Closed-Chamber-Technology)
  • Dynamic dispense arm prepared for up to 4 media lines
  • Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Automatic cartridge dispensing system CDS-50, 50 ml glass syringe
  • Top side edge bead removal (EBR circular)
  • Additional dispensing line including precision dosing pumps
  • Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  • PR tank heating system (2 ltr.)

PERFORMANCE DATA

  • Speed range: 1 to 2’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 5’000 rpm in 0.5 sec. (unloaded)
  • Delay: 5’000 rpm – 0 in 0,5 sec.
  • Process time up to 2’376 seconds per segment with 0.1 sec. steps
  • Dosing time 99 seconds/segment

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Spin Module SM-900

The Spin Modules SM-900 are the optimal choice for semi-automatic coating of larger substrates. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm (24 × 24″) substrates.

The protection disk effectively reducing air turbulence over the rotating substrate and improve the coating uniformity as the atmosphere within the closed process chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and results in a more homogeneous coating process with remarkably savings of the consumed medias.

The high-precision instruments are available as mobile cabinet units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start/stop function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • Dynamic dispense arm prepared for up to 3 media lines
  • Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional dispensing line including precision dosing pumps
  • Top side edge bead removal (EBR circular)
  • Automatic needle cleaning
  • Start/stop foot switch for ease of operation
    (cable length 1.8 m)

PERFORMANCE DATA

  • Speed range: 1 to 2’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 300 seconds per segment with 0.1 sec. steps

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

iSPRAY Series: 3D Microstructures

For substrates with a highly structured wafer topography, deep MEMS structures or a non-planar surface texture, the iSPRAY series by SAWATEC ensures that the coating is as homogeneous as possible. It is a high-precision spray coater for manual spray coating or spray development processes
and it is used specifically in research and development laboratories, for pilot productions and small production units in MEMS fabrication.

iSPRAY-300

In conjunction with low-viscosity photoresists (e.g. Shipley 1813, AZ 4999, AZ 9260, TI Spray etc.) that are particularly suited for spray coating, the process-optimised spray nozzle generates extremely fi ne droplets. Spray coating takes place by means of a loop-shaped spray pattern in a closed process chamber, thus ensuring uniform coating across the entire substrate surface and a high level of repeatability. Both round and square substrates, up to 8 wafers at a time, can be coated.

The iSPRAY-300 spray coater is designed for wafers with a maximum diameter of 300 mm or for 12 x 12 inch substrates.

FEATURES (BASIC CONFIGURATION)

  • Quick start function for repeat processes
  • User-friendly process confi guration with touch screen panel
  • Process parameters: spray pattern, spray arm speed, distance of spray nozzle, spray beam cone (x- and y-axis direction), number of spray layers
  • Electrically operated spray arm with selectable speed in the direction of the x-axis and the y-axis
  • Adjustable spray nozzle with constant nozzle pressure
  • Automatic cleaning function
  • Manual loading and unloading of the substrates
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

The standard spray coating method in the direction of X and Y can additionally be combined with a automatic Z-lift, which improves the distribution of the photoresist for certain topographies and increases the diversity of the coating. Furthermore, the iSPRAY-300 can be equipped with a heatable chuck. With this, even photoresists with a higher viscosity can be processed with little accumulation in cavities and reliable coating of the edges.

 

  • Various spray nozzles Micro 3/3, 3/4, 3/5
  • Heatable chuck up to 150° C, usable heating surface Ø 300 mm
  • Z-lift-axis for spray nozzle
  • Two spray nozzles with separate photoresist feeds to prevent contamination
  • Program controlled Filter Fan Unit (FFU)

PERFORMANCE DATA

  • Spray volume: 50 cl in buff er cartridge, supply pump with level control
  • Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
  • Spray nozzle: droplet size < 7 micron, type Micro 3
  • Speed and position accuracy of the spray arm: max. 300 mm/s; ±0.1 mm
  • Number of spray cycles: max. 20 meanders
  • Ambient temperature: +4° C to +60° C

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

SMD series: Highly Efficient

The development of the exposed photoresist is one of the most critical process steps, therefore special care need to be given to the selection of the development process and its parameters (temperature, development time, etc.). Each substrate is individually developed respectively etched in the spray development and the exposed areas are continuously sprayed with fresh developing or etching agent to prevent that the developer getting saturated.

The SAWATEC developers can be used for puddle or spray development, in which the optimum process being chosen based on application-technical and economic criteria. The advantage of the spray development compared to the puddle development is that very small fine structures can be released. The benefit of the puddle method is that significantly less developer solution is needed and better results are achieved when the substrate has deeper structures.

The SMD series is designed to clean and develop wafers up to 900mm or substrates up to 24 x 24” (600 x 600 mm).

The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are ideally suited for laboratories, R&D, institutes and pilot projects.

The instrument is available as bench-mounted or mobile cabinet unit.

Developer SMD-200 / SMD-200-E

The SMD-200 handles cleaning and development and the SMD-200-E handles etching in addition to cleaning and development. The SMD-200 and SMD-200-E are designed to process wafers up to 8″ (200 mm) or substrates up to 6 x 6″ (150 x 150 mm). The process chamber operates up to Ø 212 mm.

Both instruments are available as bench-mounted or mobile cabinet unit.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  • Electrical driven spray arm, with dynamic and static function
  • Developer line and media tank (2 litre) for one developer included
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Nozzles in the process bowl for the backside rinse
  • Control elements for dosing of the compressed air and vacuum
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Mechanical substrate fixation
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional developer lines (up to 4 developer lines possible)
  • Start/stop foot switch for ease of operation
    (cable length 1.8 m)
  • Separation unit for media exhaust (tank and laboratory equipment)
  • Developer tank heating system (2 litre)
  • Spray nozzle made of PEEK or stainless steel (0,3 / 0,5mm)

PERFORMANCE DATA

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

 

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Developer SMD-300 / SMD-300-E

The SMD-300 handles cleaning and development and the SMD-300-E handles etching in addition to cleaning and development. The SMD-300 and SMD-300-E are designed to process wafers up to 12″ (300 mm) or substrates up to 8 x 8″ (200 x 200 mm). The process chamber operates up to Ø 312 mm.

Both instruments are available as bench-mounted or mobile cabinet unit.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  • Electrical driven spray arms, with dynamic and static function
  • Developer line and media tank (2 litre) for one developer included
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Nozzles in the process bowl for the backside rinse
  • Control elements for dosing of the compressed air and vacuum
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Mechanical substrate fixation
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional developer lines (up to 4 developer lines possible)
  • Start/stop foot switch for ease of operation (cable length 1.8 m)
  • Separation unit for media exhaust (tank and laboratory equipment)
  • Developer tank heating system (2 litre)
  • Spray nozzle made of PEEK or stainless steal (0,3 / 0,5 mm)

 

LEISTUNGSDATEN

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-300) or stainless steel (SMD-300-E): 0,8 mm

1) Slower speed and acceleration for the process recommended

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Developer SMD-600

The SMD-600 is designed to clean and to develop substrates up to 400 x 400 mm. The process-chamber works up to Ø 600 mm.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Control elements for dosing of the compressed air and vacuum
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Mechanical substrate fixation
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional developer lines (up to 4 developer lines possible)
  • Start/stop foot switch for ease of operation (cable length 1.8 m)
  • Separation unit for media exhaust (tank and laboratory equipment)
  • Developer tank heating system (2 litre)
  • Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 5’000 rpm in 0.5 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 200 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Spray nozzle made from PEEK 0,8mm

1) Slower speed and acceleration for the process recommended

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Developer SMD-900

The developer SMD-900 is designed to clean and to develop substrates up to Ø 900 mm or 600 x 600mm (24 × 24″), maximum substrate weight 10 kg.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments, each can be programmed
  • Quick start/stop function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed, acceleration, process time, speed of the spray arm
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Two nozzles in the process bowl for backside rinse
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Substrate fixation with vacuum ring, mechanical centering
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional developer lines (up to 3 developer lines possible)
  • Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  • Developer tank heating system (2 litre)
  • Spray nozzle made of PEEK (0,3 / 0,5 mm)

 

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 4’320 seconds with 0,1 sec. steps
  • Speed of the spray arm 0 to 200 mm/second
  • Spray nozzle made from PEEK 0,8 mm

1) Slower speed and acceleration for heavy substrates recommended

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

SRD Series: Absolute Purity

The SAWATEC spin rinser dryers are equipped with closed stainless steel process chambers and integrated imbalance compensation. The SRD-series is characterized by its excellent process quality and high productivity.

The innovative cassette holder makes it easy to change three different cassette sizes without any tools.

These instruments are available as mobile cabinet unit and as an integral part of wet-chemical systems.

Spin Rinser Dryer SRD-150-4S

The Spin Rinser Dryer SRD-150-4S is easy to operate and to handle. With this cooling and drying centrifuge, wafers or substrates can be cleaned following wet-chemical processes and dried efficiently with the aid of centrifugal force and heated nitrogen. The process chamber respectively the cassette rotor is designed for a substrate diameter of 150 mm, with a maximum load capacity of 4 wafer cassettes, each containing 25 wafers.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, rinse and dry time, rinse and dry temperature, process chamber temperature
  • Cassettes fixation mechanically with side holder
  • Pneumatic driven cover with two hand operation
  • Automatic imbalance compensation up to 100gr. imbalance
  • Manual loading and unloading of the cassettes
  • Acoustic and optical signal when process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Customized cassette sizes
  • Customized rotor for masks-application

 

PERFORMANCE DATA

  • Loading capacity: Max. 100 wafers (4 wafer cassettes each with 25 slots)
  • Cassette sizes from 4 to 6”
  • Speed range: 0 to 1’500 rpm +/-1 rpm
  • Rinse time: 99 seconds/segments
  • N2 dry time: 99 seconds/segments
  • Rinse and dry temperature: up to 100 °C
  • Process chamber temperature: up to 70 °C

 

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Systems

Duo Series: Perfect Couple

The SAWATEC combined systems connect spin modules or developers with the hotplate series in one compact cabinet. The Duo series is convincing due to its robust design and flexible combination possibilities of the high-quality SAWATEC instruments, even for different substrate sizes. Additionally, the SM as well as the HP series convince with their high uniformity and high-precision process repeatability.

The combined systems are particular suitable for laboratories, R&D, institutes and pilot projects; they are available as mobile cabinet units.

SM-150/HP-150 duo

SM-150/HP-150 duo combines a spin module with a hotplate in one compact cabinet by default.

The SM-150 spin module is the optimal choice for manual and semi-automatic coating of thin films. It can be used for substrates with no or very low surface structure. All commercially available photoresists and coating materials can be homogeneously coated on wafers up to 150 mm (6 “) or 127 x 127 mm (5″ x 5”) substrates. The process chamber is designed for diameters up to 176 mm.

The HP-150 hotplate is designed for typical soft-bake and hard-bake processes in lithography, MEMS and similar applications. The temperature range is designed for up to 250°C by default. The set temperature and temperature profile have narrow margins so that high coating quality can be achieved. This hotplate can be used for substrates up to 150 mm (6 inches) in diameter or 127 x 127 mm (5 x 5 inches) and thicknesses up to 5 mm.

The SM-150/HP-150 duo can also be equipped with two HP-150 hotplates or with one hotplate for larger substrates (up to 300 mm).

Spin Module SM-150

 

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Manual cover with air flow inlet and sensor lock control
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Semi-automatic cartridge dispensing system, 50 ml glass syringe with manual dispensing arm and recirculation function
  • Manual nitrogen (N2) purge of the process chamber
  • Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  • Bowl assembly made of anodised aluminium
  • Bowl protector made of aluminium or PE
  • Vacuum pump for SM-150 module
  • Wafer alignment tool 2 – 6” (round)

 

Hotplate HP-150

 

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Automatic temperature limit switch, no overheating
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing manually controlled, no oxidation
  • Simple setup tool for optimal alignment of the hotplate

 

Spin Module SM-150

  • Speed range: 0 to 10’000 rpm +/-1 rpm
  • Speed acceleration: 0 – 8’000 rpm in 0,8 sec. / 0 – 10’000 rpm in 1 sec. 1)
  • Delay: 10’000 rpm – 0 in 2,5 sec. / 8’000 rpm – 0 in 0,8 sec. 1)
  • Process time up to 2376 seconds
  • Dosing time 99 seconds/segment

1) Depending on the substrate size and spin chuck type

 

Hotplate HP-150

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 1°C at 100°C

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

SM-200/HP-200 duo

The Spin Modules SM-200 are the optimal choice for semi-automatic coating of thin layers. The innovative RCCT system (Round-Closed-Chamber-Technology) effectively reducing air turbulence over the rotating substrate and improve the coating uniformity as the atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and results in a more homogeneous coating process with remarkably savings of the consumed medias.

The HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 18 mm at maximum.

Spin Module SM-200

 

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start/stop function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • RCCT system (Round-Closed-Chamber-Technology)
  • Dynamic dispense arm prepared for up to 4 media lines
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional dispensing lines including precision dosing pumps or syringe
  • Automatic cartridge dispensing system, 50 ml glass syringe CDS-50
  • Top side edge bead removal (EBR circular and linear)
  • Automatic nozzle cleaning including solvent pump
  • Program controlled Filter Fan Unit (FFU)
  • Bowl protection insert for easy and efficient cleaning
  • Wafer alignment tool 1” – 12” (round)

 

Hotplate HP-200

 

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • User-friendly process configuration with touch screen panel
  • Quick start/stop functions for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 24 program-steps
  • Proximity as well as loading pins, adaptable to different substrate sizes
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Simple setup tool for optimal alignment of the hotplate

 

Spin Module SM-200

  • Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  • Delay: 6’000 – 0 rpm in 0,8 sec.
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Dosing time depends on pump type

Hotplate HP-200

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 0.6°C at 100°C
  • Electrical driven proximity and loading pins (stroke 8 mm)
  • Program controlled adjustable proximity pins (0.1 mm increments)
  • Pin-circle-diameters Ø 45mm (2″) / Ø 92mm (4″) / Ø 142mm (6″) / Ø 192mm (8″)

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

SMD-200/HP-200 duo

These duo instrument is designed to clean, to develop or etch (depending on the version) and bake wafers.

The SMD-200 takes care of cleaning and developing and the SMD-200-E, in addition to cleaning and developing, also etches. The SMD developers from SAWATEC convince with their high process performance, low chemical consumption and reliable reproducibility even with thick photoresist layers. SAWATEC developers can be used for puddle or spray development, with the optimum process being selected according to application and economic criteria.

The HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 18 mm at maximum.

 

Developer SMD-200 / SMD-200-E

 

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  • Electrical driven spray arm, with dynamic and static function
  • Developer line and media tank (2 litre) for one developer included
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Nozzles in the process bowl for the backside rinse
  • Control elements for dosing of the compressed air and vacuum
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Mechanical substrate fixation
  • Acoustic signal when the process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Also available with SMD-200-E and HP-200
  • Additional developer lines (up to 4 developer lines possible)
  • Start/stop foot switch for ease of operation
    (cable length 1.8 m)
  • Separation unit for media exhaust (tank and laboratory equipment)
  • Developer tank heating system (2 litre)
  • Spray nozzle made of PEEK respectively stainless steel (0,3 / 0,5mm)

 

Hotplate HP-200

 

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • User-friendly process configuration with touch screen panel
  • Quick start/stop functions for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 24 program-steps
  • Proximity as well as loading pins, adaptable to different substrate sizes
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Simple setup tool for optimal alignment of the hotplate

 

Developer SMD-200 / SMD-200-E

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 100 mm/seconds
  • Rinse and N2 drying 99 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

 

Hotplate HP-200

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 0.6°C at 100°C
  • Electrical driven proximity and loading pins (stroke 8 mm)
  • Program controlled adjustable proximity pins (0.1 mm increments)
  • Pin-circle-diameters Ø 45mm (2″) / Ø 92mm (4″) / Ø 142mm (6″) / Ø 192mm (8″)

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Flexible Automation

The flexible systems connect a ROBO module with various high-quality SAWATEC instruments. The ROBO module can optionally be combined with process-oriented instruments for different substrate sizes. The big advantage is that at the beginning it is also possible to work manually and the substrate feeding can be automated afterwards with the ROBO module.

SAWATEC has developed appropriate configurations for standard process combinations.

These customized systems with highly flexible module configurations are suitable for wafers up to 12 inches.

ROBO module

Depending on the combination, the SAWATEC Robo-Module combines a hotplate with a spin module, a spray coater or a developer. The flexible systems convince with their flexible design for combining robot modules with modern process instruments. All models can be operated in manual or automatic mode.

These customized systems with highly flexible module configurations are suitable for wafers up to 12 inches in size.

FEATURES (BASIC CONFIGURATION)

  • Flexible design to combine robot module with advanced process instruments
  • All modules can be operated in the manual or in the automatic mode
  • Customized systems with highly flexible module configurations
  • Reliable process instruments, service-friendly and low downtime
  • Handling wafers from 3, 4, 6, 8 up to 12 inches
  • Central positioned 6-axis cleanroom approved robot with endeffector
  • Mechanical pre-alignment station
  • Carrier station (max. 2 carriers) with customized design adaption for different cassette types
  • Programming PolyScope graphical user interface on one 12″ touch screen with mounting device
  • Compact design and minimized space requirements, easy to clean

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Also available with up to three hotplates

 

  • Handling wafers from 3″, 4″, 6″, 8″ up to 12″

 

For more details please contact our Sales Team via contact form.

 

 

 

Offer/Documentation

CS Series: Modular System

The SAWATEC cluster systems are the perfect solution for customers looking for fully automatic cassette-to-cassette applications. The modular CS series is comprised of an optical prealigner station and three flexible stations, which can be equipped with a number of process-oriented instruments. SAWATEC has developed appropriate configurations for standard process steps.

Due to its modular, flexible design with an automatic central load station, the cluster system allows the customer to implement individual, customer- specific solutions in the production (Challenger series).

 

CS-200-4 sirius

The cluster system CS-200-4 sirius is in the first station with a spin module SM-200-CS, in the second station with a developer SMD-200-CS or SMD-200-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

 

  • High flexibility and productivity, quick amortisation
  • Advanced process instruments for high uniformity
  • Flexible process module configurations
  • Automatic wafer detection in the cassette
  • Compact design and minimized space requirements
  • Easy to control with 15” touch screen panel
  • Linux operating system
  • Optical operating status display of each process module
  • Free programmable cluster process
  • Two carriers can be processed at the same time with different substrate sizes
  • All process modules can be operated in the manual, the automatic or in the cluster mode
  • Each process module can be operated in the cluster process or as a single module
  • Access via Ethernet connection for remote diagnostics and maintenance
  • Secure data transfer with mbNET module and VPN connection
  • USB connection for onsite software uploads/updates and process data export/import
  • Each process module is freely accessible and easy to clean
  • Service-friendly, low downtime and maintenance cost
  • Substrate sizes: 3”, 4”, 6” up to max. 8” (A maximum of 3 different successive substrate sizes can be processed, 3, 4, 6” or 4, 6, 8”)

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

CS-200-4 pioneer

The cluster system CS-200-4 pioneer is in the first station with a spray coater iSPRAY-200-CS, in the second station with a developer SMD-200-CS or SMD-200-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High flexibility and productivity, thus fast amortization
  • Modern process instruments for high uniformity
  • Flexible process module configurations
  • Automatic wafer detection in the cassette
  • Compact design and minimal space requirements
  • Easy control via 15″ touch screen panel
  • Linux operating system
  • Optical operating status display of the individual process modules
  • Freely programmable cluster process
  • Two carriers can be processed simultaneously with different substrate sizes
  • All process modules can be operated in manual, automatic or cluster mode
  • Each process module can be operated in cluster process or as individual module
  • Access via Ethernet connection for remote diagnostics and maintenance possible
  • Secure data transmission with mbNET module and VPN connection
  • USB connection for software uploads/updates and process data export/import on site
  • Each process module is freely accessible and easy to clean
  • Service friendly, low downtime and maintenance costs
  • Substrate sizes: 3″, 4″, 6″ up to max. 8″ (A maximum of 3 different consecutive substrate sizes can be processed, 3, 4, 6″ or 4, 6, 8″)

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

CS-300-4 explorer

The cluster system CS-300-4 explorer is in the first station with a spin module SM-300-CS, in the second station with a developer SMD-300-CS or SMD-300-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High flexibility and productivity, quick amortisation
  • Advanced process instruments for high uniformity
  • Flexible process module configurations
  • Automatic wafer detection in the cassette
  • Compact design and minimized space requirements
  • Easy to control with 15” touch screen panel
  • Linux operating system
  • Optical operating status display of each process module
  • Free programmable cluster process
  • Two carriers can be processed at the same time with different substrate sizes
  • All process modules can be operated in the manual, the automatic or in the cluster mode
  • Each process module can be operated in the cluster process or as a single module
  • Access via Ethernet connection for remote diagnostics and maintenance
  • Secure data transfer with mbNET module and VPN connection
  • USB connection for onsite software uploads/updates and process data export/import
  • Each process module is freely accessible and easy to clean
  • Service-friendly, low downtime and maintenance cost
  • Substrate sizes: 6”, 8” up to max. 12”

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

CS-300-4 orbiter

The cluster system CS-300-4 orbiter is in the first station with a spray coater iSPRAY-300-CS, in the second station with a developer SMD-300-CS or SMD-300-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High flexibility and productivity, thus fast amortization
  • Modern process instruments for high uniformity
  • Flexible process module configurations
  • Automatic wafer detection in the cassette
  • Compact design and minimal space requirements
  • Easy control via 15″ touch screen panel
  • Linux operating system
  • Optical operating status display of the individual process modules
  • Freely programmable cluster process
  • Two carriers can be processed simultaneously with different substrate sizes
  • All process modules can be operated in manual, automatic or cluster mode
  • Each process module can be operated in cluster process or as individual module
  • Access via Ethernet connection for remote diagnostics and maintenance possible
  • Secure data transmission with mbNET module and VPN connection
  • USB connection for software uploads/updates and process data export/import on site
  • Each process module is freely accessible and easy to clean
  • Service friendly, low downtime and maintenance costs
  • Substrate sizes: 6”, 8” up to max. 12”

For more details please contact our Sales Team via contact form.

 

 

Offer/Documentation

Components

Spin chucks

OPTIMUM SPIN CHUCK FOR PERFECT COATING RESULTS
The Spin Chuck range by SAWATEC offers an optimum selection for all substrate sizes and materials to switch seamlessly from one Spin Chuck size and design to the next. To ensure that the reverse side of the substrate does not become contaminated, it is crucial to select the optimum spin chuck size and specific chuck design. Replacing the spin chucks is very easy and does not require any tools. Depending on the application, one-piece or two-piece, vacuum or mechanical spin chucks with optical centring aid are used.

TWO-PIECE SPIN CHUCK
SAWATEC developed an innovative two-piece Spin Chuck which offers great benefits. The new design reduces effectively costs for the capability of handling multiple substrate dimensions. The chuck holder made in Aluminium can be combined with a wide range of different plastic Spin Chucks. Less space is required to store a full set of different chuck sizes which is essential for work conditions where the space to operate is very limited (especially in Gloveboxes and other Cabinet applications).

 

Spin chuck set

Based on commonly used Spin Chuck sizes SAWATEC created a Spin Chuck Set which contains different Spin Chuck sizes.  The chuck holder is an integrated part of the Spin Module SM-150. The Spin Chuck Set is designed for our Spin Module SM-150 but can principally also be used for larger instruments. The older Spin Coater versions SM-180 and SM-180 easy can also use this new Spin Chuck Set but the chuck holder needs to be added to the standard set.

  • Universal Spin Chuck Set that fits interchangeable chuck sizes
  • Reduced cost for the capability of handling multiple substrate dimensions
  • Faster switching between substrates of different sizes
  • No tools required for installation
  • Compatible with all SAWATEC Spin Modules
  • Clean room applicable metal storage case for chuck sizes not in use

The set includes starting from specimen 8, 1″, 2″, 4″ and 6″ vacuum chucks.

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Bowl Protector

The SAWATEC Spin Modules are the optimal choice for manual or semi-automatic coating of thin layers. The cleanliness of the process chamber is very important to achieve good coating results. It is therefore advisable to clean the spin coater immediately after each use (cleaning instructions in accordance with the operating instructions). There are some places, which are often too little considered or need a little more cleaning effort. In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a good value bowl protection insert. This bowl protection insert is easy to remove and dispose of once the process has been completed.

  • Cost-effective and process-optimised solution
  • Perfect shape accurate fit in the process bowl
  • Significantly less contamination of the process chamber
  • Considerably shorter cleaning time
  • Simple replacement of the used bowl protection insert (disposable item)

Precision Dosing Pumps

The dosing pumps by SAWATEC feature a wide range of media viscosities, coupled with a high-precision delivery volume.

The application of hard-wearing, inert materials results in an excellent chemical compatibility with the most diverse fluids. Due to the compact, space-saving design, easy flushing and cleaning, long lifetime and low-cost maintenance, the pumps are not only used in our own instruments and systems, but also preferentially by a variety of OEM customers.

The different dosing pumps can be used for a wide range of applications and are ideally suited for use in the semiconductor industry, in the field of MEMS, in medical technology, in the chemical/pharmaceutical industry, in bottling plants and in analytical and laboratory apparatus.

Diaphragm dosing pumps SP-177

The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.

 

  • Dosing amount: 0.1 … 12 ml (± 0.1 ml, timer dependent)
  • Viscosity: 10 … 800 cps
  • Medium pressure created by the pump: < 0.2 bar (depending on tube length and viscosity)
  • Maximum flow of the medium: 4 ml/sec (depending on tube length and viscosity)
  • Pump controller
    • Vacuum: -0.4 …-0.8 bar
    • Compressed air: 0.5 … 5 bar

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Diaphragm dosing pumps SPV-15

The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.

 

  • Dosing amount: 0,1 … 15 ml (± 0,1 ml, timer dependent)
  • Viscosity: 10 … 10’000 cps
  • Medium pressure created by the pump: 0.1 … max. 5 bar (depending on tube length and viscosity)
  • Maximum flow of the medium: 4 ml/sec (depending on tube length and viscosity)
  • Pump controller
    • Vacuum: -0.4 …-0.8 bar
    • Compressed air: 0.5 … 5 bar

For more details or the documentation please contact our Sales Team via contact form.

Offer/Documentation

Diaphragm supply pump FP-20

The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.

 

  • Dosing amount: 0,1 … 20 ml (± 0,1 ml, timer dependent)
  • Viscosity: 10 … 800 cps
  • Medium pressure created by the pump: < 0.2 bar (depending on tube length and viscosity)
  • Maximum flow of the medium: 20 ml/sec  (depending on tube length and viscosity)
  • Pump controller
    • Vacuum: -0,4 … -0,8 bar
    • Compressed air: 0,5 … 5 bar

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Precision pumps GSP-98-ML

The precision pumps GSP-98-ML and GSP-98 are ideal for applications requiring high-precision dosing amounts. Due to their innovative design with integrated valve control, these pumps do not require any additional external valves. The medium is not stressed because it does not control the pump. Therefore, no gas bubbles form.

 

PUMP CONTROLLER GSP II

  • Features: Dosing, flushing, cleaning
  • 10 freely definable dosing and cleaning programmes
  • User interface via membrane keys with two-line display
  • Process parameters: Dosing, reverse, offset and suck back time
  • Controller controls the stepper motor and the magnetic valve
  • Sensor checks the initial position of the needle valve
  • Equipped with RS232 and digital I/O interface
  • Easy system integration

 

  • Dosing amount: 0,01 … 2 ml (± 0.004 ml)
  • Viscosity: 10 … 500 cps
  • Medium pressure created by the pump: < 0.2 bar (depending on tube length and viscosity)
  • Maximum flow of the medium: 2 ml/sec (depending on tube length and viscosity)
  • Stepper motor torque: 0.6 Nm
  • Pump controller: Vacuum 4 bar (+ 0.5 bar)

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Precision pumps GSP-98

The precision pumps GSP-98-ML and GSP-98 are ideal for applications requiring high-precision dosing amounts. Due to their innovative design with integrated valve control, these pumps do not require any additional external valves. The medium is not stressed because it does not control the pump. Therefore, no gas bubbles form.

 

  • Dosing amount: 0,02 … 5 ml (± 0.01 ml)
  • Viscosity: 10 … 3’000 cps
  • Medium pressure created by the pump: < 0.2 bar (depending on tube length and viscosity)
  • Maximum flow of the medium: 4 ml/sec (depending on tube length and viscosity)
  • Stepper motor torque: 0.6 Nm
  • Pump controller: Vacuum 4 bar (+ 0.5 bar)

 

For more details or the documentation please contact our Sales Team via contact form.

 

Offer/Documentation

Dosing Valve

The diaphragm dosing valve DV-257rounder among the diaphragm dosing valves. It is perfectly suited for any type of media with low to medium viscosity and explosion-proof processes.

DV-257

In addition, SAWATEC‘s product range includes further application-based valves.

A wide viscosity range, coupled with space-saving designs, a long life cycle thanks to hard-wearing materials, very easy cleaning and inexpensive maintenance distinguish all SAWATEC dosing valves.