HP Series: Easy To Bake
SAWATEC AG supplies various hotplates for typical soft bake and hard bake processes in lithography, MEMS and similar applications. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability.
Outstanding features of the manual and semi-automatic hotplates are their robust design and ease of operation. The extensive HP series can be used for wafers from 150 mm up to 900 mm or 12×12 inch substrates.
The hot-plate is covered with protection glass, which makes cleaning easier. Due to the high quality, robust design and easy handling, SAWATEC Hotplates are preferentially used in laboratories, R & D and small-scale production.
Hotplate HP-150
The temperature range of the Hotplate HP-150 is designed for up to 250°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 150 mm and thicknesses of 5 mm at maximum.
The hotplate is covered with safety glass, which makes cleaning easier. Due to the highquality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.
The high-precision, good value instruments are available both as portable bench-top and bench-mounted units.
FEATURES (BASIC CONFIGURATION)
- Temperature control with digital target and actual value display
- Automatic temperature limit switch, no overheating
- Hotplate with safety glass, easy cleaning
- Easy levelling of the hotplate, prevents discharge of photoresist
- Manual substrate fixation via vacuum
- Manual loading and unloading of the substrates
ADDITIONAL FUNCTIONS (OPTIONS)
- N2 flushing manually controlled, no oxidation
- Simple setup tool for optimal alignment of the hotplate
PERFORMANCE DATA
- Temperature range: ambient temperature up to 250°C
- Temperature accuracy: +/- 1°C at 100°C
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Hotplate HP-200
High precision soft and hard baking
The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The high-precision instruments are available as mobile cabinet, portable bench-top and benchmounted unit.
FEATURES (BASIC CONFIGURATION)
- Temperature control with digital target and actual value display
- User-friendly process configuration with touch screen
- Quick start/stop function for repeat processes
- Automatic temperature limit switch, no overheating
- Heating ramp up possible with 24 program steps
- Proximity/loading pins, can be easily adapted to different substrate sizes
- Hot-plate with protection glass, easy cleaning
- Easy levelling of the hot-plate, prevents discharge of photoresist
- Manual substrate fixation via vacuum
- Manual loading and unloading of the substrates
ADDITIONAL FUNCTIONS (OPTIONS)
- N2 flushing program controlled, no oxidation
- HMDS priming program controlled, optimized adhesion
- Setup tool for optimal height adjustment of the pins and leveling of the Hotplate
PERFORMANCE DATA
- Temperature range: ambient temperature up to 250 °C
- Temperature accuracy: +/- 0.6 °C at 100 °C
- Electrical driven proximity and loading pins (stroke 8 mm)
- Program controlled adjustable proximity pins (0.1 mm increments)
- Pin-circle-diameters: 45 – 192 mm (2 – 8″)
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Hotplate HP-300
High precision soft and hard baking
The Hotplate HP-300 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 300 mm and thickness of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The high-precision instruments are available as mobile cabinet and bench-mounted unit.
FEATURES (BASIC CONFIGURATION)
- Temperature control with digital target and actual value display
- User-friendly process configuration with touch screen
- Quick start/stop function for repeat processes
- Automatic temperature limit switch, no overheating
- Heating ramp up possible with 24 program steps
- Proximity as well as loading pins, can be easily adapted to different substrate sizes
- Hot-plate with protection glass, easy cleaning
- Easy levelling of the hot-plate, prevents discharge of photoresist
- Manual substrate fixation via vacuum
- Manual loading and unloading of the substrates
ADDITIONAL FUNCTIONS (OPTIONS)
- N2 flushing program controlled, no oxidation
- HMDS priming program controlled, optimized adhesion
- Setup tool for optimal height adjustment of the pins and leveling of the Hotplate
PERFORMANCE DATA
- Temperature range: ambient temperature up to 250 °C
- Temperature accuracy: +/- 0.8 °C at 100 °C
- Electrical driven proximity and loading pins (stroke 8 mm)
- Program controlled adjustable proximity pins (0.1 mm increments)
- Pin-circle-diameters: 45 – 292 mm (2 – 12″)
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Hotplate HP-600
The temperature range of the Hotplate HP-600 is designed for up to 200°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with sizes of 200 x 200 mm up to 600 x 600 mm, round or square.
The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.
The high-precision Hotplate HP-300 is available as a mobile cabinet.
FEATURES (BASIC CONFIGURATION)
- Temperature control with digital target and actual value display
- Quick start/stop function for repeat processes
- Automatic temperature limit switch, no overheating
- Heating ramp up possible with 24 program-steps
- Proximity as well as loading pins
- Hotplate with safety glass, easy cleaning
- User-friendly process configuration with touch screen panel
- Manual substrate fixation via vacuum
- Manual loading and unloading of the substrates
ADDITIONAL FUNCTIONS (OPTIONS)
- Simple setup tool for optimal alignment of the hotplate
PERFORMANCE DATA
- Temperature range: ambient temperature up to 200°C
- Temperature accuracy: +/- 1.5°C at 100°C
- Electrical driven proximity and loading pins
- Substrate with a weight of max. 10 kg can be processed
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
CP series: controlled cooling
At SAWATEC you can get different coolplates for fast and controlled cooling of flat substrates. The coolplate series avoids long waiting times for cooling the substrates or wafers. If required, the cooling rate can be increased with a chiller.
The manual and semi-automatic coolplates impress with their high-quality design and easy handling.
Coolplates are available as bench-mounted or cabinet version.
Coolplate CP-200
The Coolplate CP-200 was developed for thermal management in the semiconductor and MEMS industry, e.g. for cooling wafers. It can be used for substrates up to Ø 200 mm and thicknesses up to 14 mm or with wafers ranging in size from 50 x 50 to 200 x 200mm, round or square.
Outstanding features of the manual and semi-automatic hotplates are their robust design and ease of operation.
FEATURES (BASIC CONFIGURATION)
- Temperature control with digital target and actual value display
- User-friendly process configuration with touch screen panel
- Quick start/stop function for repeat processes
- Automatic temperature limit switch
- Proximity as well as loading pins, can be easily adapted to different substrate sizes
- Manual substrate fixation via vacuum
- Manual loading and unloading of substrates
ADDITIONAL FUNCTIONS (OPTIONS)
- Simple setup tool for optimal alignment of the coolplate
PERFORMANCE DATA
- Temperature range: 5 – 23°C
- Electrical driven proximity and loading pins
- Proximity adjustment from 0-1 mm (0.1 mm steps)
- Substrate size: max. 200 mm (round or square)
- Coolramp with 24 program steps possible
- Manual substrate fixation via vacuum
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
SM Series: Coating2
The Spin Modules are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm (24 x 24″) substrates.
The SM series is convincing due to its high level of uniformity and repeatability, coupled with easy operation and comfortable handling. In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a comprehensive and good value bowl protection insert. This bowl protector is easy to remove and dispose of once the process has been completed. Due to the high-quality design, the maintenance effort is minimal. Therefore, the SAWATEC Spin Modules are preferentially used in laboratories, R & D and small-scale production.
Spin Module SM-150
Ideal for manual coatings
The Spin Modules SM-150 are the optimal choice for manual coating of thin layers. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 150 mm (6 inches) or 127 x 127mm (5×5 inches) substrates. The process chamber is designed for a diameter of up to 176 mm.
The high-precision, good value instruments are available both as portable bench-top and bench mounted unit.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen
- Process parameters: spin speed, acceleration, segment time, dosing functions
- Rotational direction can be selected (CW, CCW)
- Manual loading and unloading of the substrates
- Substrate fixation via vacuum incl. vacuum guard
- Manual cover with air flow inlet and sensor lock control
- Acoustic signal after the end of the process
ADDITIONAL FUNCTIONS (OPTIONS)
- Semi-automatic cartridge dosing system, 50 ml glass cartridge with manual dispensing arm and suck back function
- Nitrogen (N2) purge of the process chamber to prevent oxidation
- Start/stop foot switch for ease of operation (cable length
1.8 m)
- Bowl assembly made of anodised aluminium or stainless steel
- Wafer alignment tool 1” – 12” (round)
- Bowl protection insert made of aluminium
- Vacuum pump
PERFORMANCE DATA
- Speed range: 0 to 10’000 rpm +/-1 rpm
- Speed acceleration: 0 – 10’000 rpm in 1 sec.*
- Delay: 10’000 rpm – 0 in 2,5 sec.*
- Process time up to 7‘200 seconds
* Depending on the substrate size and spin chuck type
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Spin Module SM-200
Optimal choice for semi-automatic coatings
The Spin Module SM-200 is the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 200 mm (8 inches) or 150 x 150mm (6×6 inches) substrates.
The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The high-precision instruments are available both as mobile cabinet and bench-mounted unit.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start/stop function for repeat processes
- User-friendly process configuration with touchscreen
- Process parameters: spin speed, segment time, dosing functions
- Rotational direction can be selected (CW, CCW)
- Dynamic dosing arm for up to 4 media lines
- Manual loading and unloading of the substrates
- Substrate fixation via vacuum incl. vacuum guard
- Acoustic signal after the end of the process
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional dosing lines
- Automatic cartridge dosing system, 50 ml glass cartridge
- Top side edge bead removal (EBR circular and linear)
- Backside rinse of substrates to remove any backside edge contamination
- Automatic needle cleaning
- Program controlled Filter Fan Unit (FFU)
- Bowl protection insert for easy and efficient cleaning
- Wafer alignment tool 1 – 12″ (round)
PERFORMANCE DATA
- Speed range: 1 to 6’000 rpm +/-1 rpm
- Difference from set rotation speed to actual value < +/-1 %
- Speed acceleration: 0 – 6’000 rpm in min. 1 sec. (chuck size ≤ 150 mm)
- Process time up to 7’200 seconds with 0,1 sec. steps
- Time controlled dosage
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Spin Module SM-300
Optimal choice for semi-automatic coatings
The Spin Module SM-300 is the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 300 mm (12 inches) or 200 x 200 mm (8 × 8 inches) substrates.
The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The high-precision instruments are available both as mobile cabinet and bench-mounted units.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start/stop function for repeat processes
- User-friendly process configuration with touch screen
- Process parameters: spin speed, segment time, dosing functions
- Rotational direction can be selected (CW, CCW)
- Dynamic dosing arm for up to 4 media lines
- Manual loading and unloading of the substrates
- Substrate fixation via vacuum incl. vacuum guard
- Acoustic signal after the end of the process
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional dispensing lines
- Automatic cartridge dosing system, 50 ml glass cartridge
- Top side edge bead removal (EBR circular and linear)
- Backside rinse of substrates to remove any backside edge contamination
- Automatic needle cleaning
- Program controlled Filter Fan Unit (FFU)
- Bowl protection insert for easy and efficient cleaning
- Wafer alignment tool 1 – 12″ (round)
PERFORMANCE DATA
- Speed range: 1 to 6’000 rpm +/-1 rpm
- Difference from set rotation speed to actual value < +/-1 %
- Speed acceleration: 0 – 6’000 rpm in min. 1 sec. (chuck size ≤ 150 mm)
- Process time up to 7’200 seconds with 0,1 sec. steps
- Time controlled dosage
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Spin Module SM-600
The Spin Modules SM-600 are the optimal choice for semi-automatic coating of larger substrates. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 600 mm or 16 × 16 inch substrates.
The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber, resulting in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The high-precision instruments are available as mobile cabinet units.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameters: speed, acceleration, time
- Rotational direction can be selected (CW, CCW)
- RCCT system (Round-Closed-Chamber-Technology)
- Dynamic dispense arm prepared for up to 4 media lines
- Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
- Manual loading and unloading of the substrates
- Substrate fixation via vacuum and safety interlock protection
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Automatic cartridge dosing system CDS-50, 50 ml glass syringe
- Top side edge bead removal (EBR circular)
- Additional dispensing line including precision dosing pumps
- Start/stop foot switch for ease of operation (cable
length 1.8 m)
- PR tank heating system (2 ltr.)
PERFORMANCE DATA
- Speed range: 1 to 2’000 rpm +/-1 rpm
- Difference from set rotation speed to actual value < +/-1 %
- Speed acceleration: 0 – 5’000 rpm in 0.5 sec. (unloaded)
- Delay: 5’000 rpm – 0 in 0,5 sec.
- Process time up to 2’376 seconds per segment with 0.1 sec. steps
- Dosing time 99 seconds/segment
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Spin Module SM-900
The Spin Modules SM-900 are the optimal choice for semi-automatic coating of larger substrates. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm (24 × 24″) substrates.
The protection disk effectively reducing air turbulence over the rotating substrate and improve the coating uniformity as the atmosphere within the closed process chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and results in a more homogeneous coating process with remarkably savings of the consumed medias.
The high-precision instruments are available as mobile cabinet units.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start/stop function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameters: speed, acceleration, time
- Rotational direction can be selected (CW, CCW)
- Dynamic dispense arm prepared for up to 3 media lines
- Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
- Manual loading and unloading of the substrates
- Substrate fixation via vacuum and safety interlock protection
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional dispensing line including precision dosing pumps
- Top side edge bead removal (EBR circular)
- Automatic needle cleaning
- Start/stop foot switch for ease of operation
(cable length 1.8 m)
PERFORMANCE DATA
- Speed range: 1 to 2’000 rpm +/-1 rpm
- Difference from set rotation speed to actual value < +/-1 %
- Speed acceleration: max. 300 rad/s” (unloaded)
- Process time up to 300 seconds per segment with 0.1 sec. steps
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
iSPRAY Series: 3D Microstructures
For substrates with a highly structured wafer topography, deep MEMS structures or a non-planar surface texture, the iSPRAY-300 by SAWATEC ensures that the coating is as homogeneous as possible. It is a high-precision spray coater for manual spray coating or spray development processes and it is used specifically in research and development laboratories, for pilot productions and small production units in MEMS fabrication.
iSPRAY-300
Uniform coating of 3D microstructures
In conjunction with low-viscosity photoresists (e.g. Shipley 1813, AZ 4999, AZ 9260, TI Spray etc.) that are particularly suited for spray coating, the process-optimised spray nozzle generates extremely fine droplets. Spray coating takes place by means of a loop-shaped spray pattern in a closed process chamber, thus ensuring uniform coating across the entire substrate surface and a high level of repeatability. The spray nozzle spacing, which can be adjusted as a function of the process, improves the distribution of the spray coating for specific topographies and increases coating versatility. Both round and square substrates, up to 8 wafers at a time, can be coated.
The iSPRAY-300 spray coater is designed for wafers with a maximum diameter of 300 mm or for
12 × 12 inch substrates.
FEATURES (BASIC CONFIGURATION)
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameters: spray pattern, spray arm speed, distance of spray nozzle, spray beam cone (x- and y-axis direction), number of spray layers
- Electrically operated spray arm with selectable speed in the direction of the x-axis and the y-axis
- Automatic adjustment of the spray nozzle distance (z-hub)
- Adjustable spray nozzle with constant spray pressure and automatic cleaning function
- Manual loading and unloading of the substrates
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Various spray nozzles Micro 3/3, 3/4, 3/5
- Heatable chuck up to 150° C, usable heating surface
Ø 300 mm
- Second spray nozzle with separate photoresist feeds to prevent contamination
- Program controlled Filter Fan Unit (FFU)
PERFORMANCE DATA
- Spray volume: 50 cl in buffer cartridge, supply pump with level control
- Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
- Spray nozzle: droplet size < 7 micron, type Micro 3
- Speed and position accuracy of the spray arm:
max. 200 mm/s; ±0.1 mm
- Number of spray cycles: max. 20 meanders
- Ambient temperature: +4° C to +60° C
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
SMD series: Highly Efficient
The development of the exposed photoresist is one of the most critical process steps, therefore special care need to be given to the selection of the development process and its parameters (temperature, development time, etc.). Each substrate is individually developed respectively etched in the spray development and the exposed areas are continuously sprayed with fresh developing or etching agent to prevent that the developer getting saturated.
The SAWATEC developers can be used for puddle or spray development, in which the optimum process being chosen based on application-technical and economic criteria. The advantage of the spray development compared to the puddle development is that very small fine structures can be released. The benefit of the puddle method is that significantly less developer solution is needed and better results are achieved when the substrate has deeper structures.
The SMD series is designed to clean and develop wafers up to 900mm or substrates up to 24 x 24” (600 x 600 mm).
The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are ideally suited for laboratories, R&D, institutes and pilot projects.
The instrument is available as bench-mounted or mobile cabinet unit.
Developer SMD-200 / SMD-200-E
The SMD-200 handles cleaning and development and the SMD-200-E handles etching in addition to cleaning and development. The SMD-200 and SMD-200-E are designed to process wafers up to 8″ (200 mm) or substrates up to 6 x 6″ (150 x 150 mm). The process chamber operates up to Ø 212 mm.
Both instruments are available as bench-mounted or mobile cabinet unit.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
- Electrical driven spray arm, with dynamic and static function
- Developer line and media tank (2 litre) for one developer included
- Nozzle for DI-water-rinse and N2 drying on the spray arm
- Nozzles in the process bowl for the backside rinse
- Control elements for dosing of the compressed air and vacuum
- Rotational direction can be selected (CW, CCW)
- Manual loading and unloading of the substrates
- Mechanical substrate fixation
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional developer lines (up to 4 developer lines possible)
- Start/stop foot switch for ease of operation
(cable length 1.8 m)
- Separation unit for media exhaust (tank and laboratory equipment)
- Developer tank heating system (2 litre)
- Spray nozzle made of PEEK or stainless steel (0,3 / 0,5mm)
PERFORMANCE DATA
- Speed range: 0 to 3’000 rpm +/-1 rpm 1)
- Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
- Process time up to 2376 seconds
- Developer spray time 99 seconds/segment
- Speed of the spray arm 10 to 100 mm/second
- Rinse and N2 drying 99 seconds/segment
- Heatable process hood up to 50 °C
- Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm
1) Slower speed and acceleration for the process recommended
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Developer SMD-300 / SMD-300-E
The SMD-300 handles cleaning and development and the SMD-300-E handles etching in addition to cleaning and development. The SMD-300 and SMD-300-E are designed to process wafers up to 12″ (300 mm) or substrates up to 8 x 8″ (200 x 200 mm). The process chamber operates up to Ø 312 mm.
Both instruments are available as bench-mounted or mobile cabinet unit.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
- Electrical driven spray arms, with dynamic and static function
- Developer line and media tank (2 litre) for one developer included
- Nozzle for DI-water-rinse and N2 drying on the spray arm
- Nozzles in the process bowl for the backside rinse
- Control elements for dosing of the compressed air and vacuum
- Rotational direction can be selected (CW, CCW)
- Manual loading and unloading of the substrates
- Mechanical substrate fixation
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional developer lines (up to 4 developer lines possible)
- Start/stop foot switch for ease of operation (cable length 1.8 m)
- Separation unit for media exhaust (tank and laboratory equipment)
- Developer tank heating system (2 litre)
- Spray nozzle made of PEEK or stainless steal (0,3 / 0,5 mm)
LEISTUNGSDATEN
- Speed range: 0 to 3’000 rpm +/-1 rpm 1)
- Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
- Process time up to 2376 seconds
- Developer spray time 99 seconds/segment
- Speed of the spray arm 10 to 100 mm/second
- Rinse and N2 drying 99 seconds/segment
- Heatable process hood up to 50 °C
- Spray nozzle made of PEEK (SMD-300) or stainless steel (SMD-300-E): 0,8 mm
1) Slower speed and acceleration for the process recommended
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Developer SMD-600
The SMD-600 is designed to clean and to develop substrates up to 400 x 400 mm. The process-chamber works up to Ø 600 mm.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
- Electrical driven spray arm, with dynamic or static function
- Developer line and media tank for one developer included
- Nozzle for DI-water-rinse and N2 drying on the spray arm
- Control elements for dosing of the compressed air and vacuum
- Rotational direction can be selected (CW, CCW)
- Manual loading and unloading of the substrates
- Mechanical substrate fixation
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional developer lines (up to 4 developer lines possible)
- Start/stop foot switch for ease of operation (cable length 1.8 m)
- Separation unit for media exhaust (tank and laboratory equipment)
- Developer tank heating system (2 litre)
- Spray nozzle made of PEEK (0,3 / 0,5 mm)
PERFORMANCE DATA
- Speed range: 0 to 2’000 rpm +/-1 rpm 1)
- Speed acceleration: 0 to 5’000 rpm in 0.5 seconds 1)
- Process time up to 2376 seconds
- Developer spray time 99 seconds/segment
- Speed of the spray arm 10 to 200 mm/second
- Rinse and N2 drying 99 seconds/segment
- Spray nozzle made from PEEK 0,8mm
1) Slower speed and acceleration for the process recommended
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
Developer SMD-900
The developer SMD-900 is designed to clean and to develop substrates up to Ø 900 mm or 600 x 600mm (24 × 24″), maximum substrate weight 10 kg.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments, each can be programmed
- Quick start/stop function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameter: speed, acceleration, process time, speed of the spray arm
- Electrical driven spray arm, with dynamic or static function
- Developer line and media tank for one developer included
- Nozzle for DI-water-rinse and N2 drying on the spray arm
- Two nozzles in the process bowl for backside rinse
- Rotational direction can be selected (CW, CCW)
- Manual loading and unloading of the substrates
- Substrate fixation with vacuum ring, mechanical centering
- Acoustic signal when the process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Additional developer lines (up to 3 developer lines possible)
- Start/stop foot switch for ease of operation (cable
length 1.8 m)
- Developer tank heating system (2 litre)
- Spray nozzle made of PEEK (0,3 / 0,5 mm)
PERFORMANCE DATA
- Speed range: 0 to 2’000 rpm +/-1 rpm 1)
- Speed acceleration: max. 300 rad/s” (unloaded)
- Process time up to 4’320 seconds with 0,1 sec. steps
- Speed of the spray arm 0 to 200 mm/second
- Spray nozzle made from PEEK 0,8 mm
1) Slower speed and acceleration for heavy substrates recommended
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation
SRD Series: Absolute Purity
The SAWATEC spin rinser dryers are equipped with closed stainless steel process chambers and integrated imbalance compensation. The SRD-series is characterized by its excellent process quality and high productivity.
The innovative cassette holder makes it easy to change three different cassette sizes without any tools.
These instruments are available as mobile cabinet unit and as an integral part of wet-chemical systems.
Spin Rinser Dryer SRD-150-4S
The Spin Rinser Dryer SRD-150-4S is easy to operate and to handle. With this cooling and drying centrifuge, wafers or substrates can be cleaned following wet-chemical processes and dried efficiently with the aid of centrifugal force and heated nitrogen. The process chamber respectively the cassette rotor is designed for a substrate diameter of 150 mm, with a maximum load capacity of 4 wafer cassettes, each containing 25 wafers.
FEATURES (BASIC CONFIGURATION)
- Up to 50 programmes with 24 segments each can be programmed
- Quick start function for repeat processes
- User-friendly process configuration with touch screen panel
- Process parameters: speed, rinse and dry time, rinse and dry temperature, process chamber temperature
- Cassettes fixation mechanically with side holder
- Pneumatic driven cover with two hand operation
- Automatic imbalance compensation up to 100gr. imbalance
- Manual loading and unloading of the cassettes
- Acoustic and optical signal when process has finished
ADDITIONAL FUNCTIONS (OPTIONS)
- Customized cassette sizes
- Customized rotor for masks-application
PERFORMANCE DATA
- Loading capacity: Max. 100 wafers (4 wafer cassettes each with 25 slots)
- Cassette sizes from 4 to 6”
- Speed range: 0 to 1’500 rpm +/-1 rpm
- Rinse time: 99 seconds/segments
- N2 dry time: 99 seconds/segments
- Rinse and dry temperature: up to 100 °C
- Process chamber temperature: up to 70 °C
For more details or the documentation please contact our Sales Team via contact form.
Offer/Documentation