Product range along the processing steps
Our wide range of application-oriented instruments, systems and components is used for various processing steps along the entire process chain, offering versatile customer benefit.
For special customer requirements we also developed custom-made products which transgress into the physical and technical limits and move today’s process boundaries constantly new.
SAWATEC AG supplies various hotplates for typical soft bake and hard bake processes in lithography, MEMS and similar applications. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability.
Outstanding features of the manual and semi-automatic hotplates are their robust design and ease of operation. The extensive HP series can be used for wafers from 150 mm up to 900 mm or 12×12 inch substrates.
The hot-plate is covered with protection glass, which makes cleaning easier. Due to the high quality, robust design and easy handling, SAWATEC Hotplates are preferentially used in laboratories, R & D and small-scale production.
The temperature range of the Hotplate HP-150 is designed for up to 250°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 150 mm and thicknesses of 5 mm at maximum.
The hotplate is covered with safety glass, which makes cleaning easier. Due to the highquality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.
The high-precision, good value instruments are available both as portable bench-top and bench-mounted units.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
High precision soft and hard baking
The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The high-precision instruments are available as mobile cabinet, portable bench-top and benchmounted unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
Ultra-high precision soft and hard baking
The Hotplate HP-200-Z was developed for ultra-high precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 300 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum.
The multi-zone heating system ensures very high temperature distribution, which is adjustable for each zone. The hotplate also has a vacuum chamber and can be used as standard for bonding agent applications. The hotplate is covered with protection glass, which makes cleaning easier. Due to the high quality, robust design and easy handling, SAWATEC hotplates are preferentially used in laboratories, R & D and small-scale production.
The ultra-high precision instruments are available as mobile cabinet and bench-mounted unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS
• Setup tool for optimal leveling of the Hotplate
For more details or the documentation please contact our Sales Team via contact form.
High precision soft and hard baking
The Hotplate HP-300 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 300 mm and thickness of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The high-precision instruments are available as mobile cabinet and bench-mounted unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
The temperature range of the Hotplate HP-600 is designed for up to 200°C. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with sizes of 200 x 200 mm up to 600 x 600 mm, round or square.
The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.
The high-precision Hotplate HP-300 is available as a mobile cabinet.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
At SAWATEC you can get different Coolplates for fast and controlled cooling of flat substrates. The Coolplate series shortens the process time when cooling the substrates or wafers. If required, the cooling rate can be increased with a chiller.
The semi-automatic Coolplates impress with their high-quality design and easy handling. It can be used for substrates up to Ø 200 mm and thicknesses up to 14 mm or with wafers ranging in size from 50 x 50 to 200 x 200 mm, round or square.
Coolplates are available as mobile cabinet and bench-mounted unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
The Spin Modules are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm (24 x 24″) substrates.
The SM series is convincing due to its high level of uniformity and repeatability, coupled with easy operation and comfortable handling. In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a comprehensive and good value bowl protection insert. This bowl protector is easy to remove and dispose of once the process has been completed. Due to the high-quality design, the maintenance effort is minimal. Therefore, the SAWATEC Spin Modules are preferentially used in laboratories, R & D and small-scale production.
Ideal for manual coatings
The Spin Modules SM-150 are the optimal choice for manual coating of thin layers. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 150 mm (6 inches) or 127 x 127mm (5×5 inches) substrates. The process chamber is designed for a diameter of up to 176 mm.
The high-precision, good value instruments are available both as portable bench-top and bench mounted unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
* Depending on the substrate size and spin chuck type
For more details or the documentation please contact our Sales Team via contact form.
Optimal choice for semi-automatic coatings
The Spin Module SM-200 is the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 200 mm (8 inches) or 150 x 150mm (6×6 inches) substrates.
The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The high-precision instruments are available both as mobile cabinet and bench-mounted unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
Optimal choice for semi-automatic coatings
The Spin Module SM-300 is the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 300 mm (12 inches) or 200 x 200 mm (8 × 8 inches) substrates.
The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The high-precision instruments are available both as mobile cabinet and bench-mounted units.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
The Spin Modules SM-600 are the optimal choice for semi-automatic coating of larger substrates. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 600 mm or 16 × 16 inch substrates.
The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber, resulting in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The high-precision instruments are available as mobile cabinet units.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
The Spin Modules SM-900 are the optimal choice for semi-automatic coating of larger substrates. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm (24 × 24″) substrates.
The protection disk effectively reducing air turbulence over the rotating substrate and improve the coating uniformity as the atmosphere within the closed process chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and results in a more homogeneous coating process with remarkably savings of the consumed medias.
The high-precision instruments are available as mobile cabinet units.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
For substrates with a highly structured wafer topography, deep MEMS structures or a non-planar surface texture, the iSPRAY-300 by SAWATEC ensures that the coating is as homogeneous as possible. It is a high-precision spray coater for manual spray coating or spray development processes and it is used specifically in laboratories, R & D and small-scale production in MEMS fabrication.
Uniform coating of 3D microstructures
In conjunction with low-viscosity photoresists (e.g. Shipley 1813, AZ 4999, AZ 9260, TI Spray etc.) that are particularly suited for spray coating, the process-optimised spray nozzle generates extremely fine droplets. Spray coating takes place by means of a loop-shaped spray pattern in a closed process chamber, thus ensuring uniform coating across the entire substrate surface and a high level of repeatability. The spray nozzle spacing, which can be adjusted as a function of the process, improves the distribution of the spray coating for specific topographies and increases coating versatility. Both round and square substrates, up to 8 wafers at a time, can be coated.
The iSPRAY-300 spray coater is designed for wafers with a maximum diameter of 300 mm or for 12 × 12 inch substrates. The high-precision instruments are available as mobile cabinet.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
The development of the exposed photoresist is one of the most critical process steps, therefore special care need to be given to the selection of the development process and its parameters (temperature, development time, etc.). Each substrate is individually developed respectively etched in the spray development and the exposed areas are continuously sprayed with fresh developing or etching agent to prevent that the developer getting saturated.
The SAWATEC developers can be used for puddle or spray development, in which the optimum process being chosen based on application-technical and economic criteria. The advantage of the spray development compared to the puddle development is that very small fine structures can be released. The benefit of the puddle method is that significantly less developer solution is needed and better results are achieved when the substrate has deeper structures.
The SMD series is designed to clean and develop wafers up to 900mm or substrates up to 24 x 24” (600 x 600 mm).
The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are ideally suited for laboratories, R&D, institutes and pilot projects.
The instrument is available as bench-mounted or mobile cabinet unit.
The SMD-200 handles cleaning and development and the SMD-200-E handles etching in addition to cleaning and development. The SMD-200 and SMD-200-E are designed to process wafers up to 8″ (200 mm) or substrates up to 6 x 6″ (150 x 150 mm). The process chamber operates up to Ø 212 mm.
Both instruments are available as bench-mounted or mobile cabinet unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
1) Slower speed and acceleration for the process recommended
For more details or the documentation please contact our Sales Team via contact form.
The SMD-300 handles cleaning and development and the SMD-300-E handles etching in addition to cleaning and development. The SMD-300 and SMD-300-E are designed to process wafers up to 12″ (300 mm) or substrates up to 8 x 8″ (200 x 200 mm). The process chamber operates up to Ø 312 mm.
Both instruments are available as bench-mounted or mobile cabinet unit.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
LEISTUNGSDATEN
1) Slower speed and acceleration for the process recommended
For more details or the documentation please contact our Sales Team via contact form.
The SMD-600 is designed to clean and to develop substrates up to 400 x 400 mm. The process-chamber works up to Ø 600 mm.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
1) Slower speed and acceleration for the process recommended
For more details or the documentation please contact our Sales Team via contact form.
The developer SMD-900 is designed to clean and to develop substrates up to Ø 900 mm or 600 x 600mm (24 × 24″), maximum substrate weight 10 kg.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
1) Slower speed and acceleration for heavy substrates recommended
For more details or the documentation please contact our Sales Team via contact form.
The SAWATEC spin rinser dryers are equipped with closed stainless steel process chambers and integrated imbalance compensation. The SRD-series is characterized by its excellent process quality and high productivity.
The innovative cassette holder makes it easy to change three different cassette sizes without any tools.
These instruments are available as mobile cabinet unit and as an integral part of wet-chemical systems.
The Spin Rinser Dryer SRD-150-4S is easy to operate and to handle. With this cooling and drying centrifuge, wafers or substrates can be cleaned following wet-chemical processes and dried efficiently with the aid of centrifugal force and heated nitrogen. The process chamber respectively the cassette rotor is designed for a substrate diameter of 150 mm, with a maximum load capacity of 4 wafer cassettes, each containing 25 wafers.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
PERFORMANCE DATA
For more details or the documentation please contact our Sales Team via contact form.
The SAWATEC combined systems connect spin modules or developers with the hotplate series in one compact cabinet. The Duo series is convincing due to its robust design and flexible combination possibilities of the high-quality SAWATEC instruments, even for different substrate sizes. Additionally, the SM as well as the HP series convince with their high uniformity and high-precision process repeatability.
The combined systems are particular suitable for laboratories, R&D, institutes and pilot projects; they are available as mobile cabinet units.
SM-150/HP-150 duo combines a spin module with a hotplate in one compact cabinet by default.
The SM-150 spin module is the optimal choice for manual and semi-automatic coating of thin films. It can be used for substrates with no or very low surface structure. All commercially available photoresists and coating materials can be homogeneously coated on wafers up to 150 mm (6 “) or 127 x 127 mm (5″ x 5”) substrates. The process chamber is designed for diameters up to 176 mm.
The HP-150 hotplate is designed for typical soft-bake and hard-bake processes in lithography, MEMS and similar applications. The temperature range is designed for up to 250°C by default. The set temperature and temperature profile have narrow margins so that high coating quality can be achieved. This hotplate can be used for substrates up to 150 mm (6 inches) in diameter or 127 x 127 mm (5 x 5 inches) and thicknesses up to 5 mm.
The SM-150/HP-150 duo can also be equipped with two HP-150 hotplates or with one hotplate for larger substrates (up to 300 mm).
Spin Module SM-150
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
Hotplate HP-150
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
Spin Module SM-150
1) Depending on the substrate size and spin chuck type
Hotplate HP-150
For more details or the documentation please contact our Sales Team via contact form.
The Spin Modules SM-200 are the optimal choice for semi-automatic coating of thin layers. The innovative RCCT system (Round-Closed-Chamber-Technology) effectively reducing air turbulence over the rotating substrate and improve the coating uniformity as the atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and results in a more homogeneous coating process with remarkably savings of the consumed medias.
The HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 18 mm at maximum.
Spin Module SM-200
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
Hotplate HP-200
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
Spin Module SM-200
Hotplate HP-200
For more details or the documentation please contact our Sales Team via contact form.
These duo instrument is designed to clean, to develop or etch (depending on the version) and bake wafers.
The SMD-200 takes care of cleaning and developing and the SMD-200-E, in addition to cleaning and developing, also etches. The SMD developers from SAWATEC convince with their high process performance, low chemical consumption and reliable reproducibility even with thick photoresist layers. SAWATEC developers can be used for puddle or spray development, with the optimum process being selected according to application and economic criteria.
The HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 18 mm at maximum.
Developer SMD-200 / SMD-200-E
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
Hotplate HP-200
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
Developer SMD-200 / SMD-200-E
1) Slower speed and acceleration for the process recommended
Hotplate HP-200
For more details or the documentation please contact our Sales Team via contact form.
The flexible systems connect a ROBO module with various high-quality SAWATEC instruments. The ROBO module can optionally be combined with process-oriented instruments for different substrate sizes. The big advantage is that at the beginning it is also possible to work manually and the substrate feeding can be automated afterwards with the ROBO module.
SAWATEC has developed appropriate configurations for standard process combinations.
These customized systems with highly flexible module configurations are suitable for wafers up to 12 inches.
Depending on the combination, the SAWATEC Robo-Module combines a hotplate with a spin module, a spray coater or a developer. The flexible systems convince with their flexible design for combining robot modules with modern process instruments. All models can be operated in manual or automatic mode.
These customized systems with highly flexible module configurations are suitable for wafers up to 12 inches in size.
FEATURES (BASIC CONFIGURATION)
ADDITIONAL FUNCTIONS (OPTIONS)
The SAWATEC cluster systems are the perfect solution for customers looking for fully automatic cassette-to-cassette applications. The modular CS series is comprised of an optical prealigner station and three flexible stations, which can be equipped with a number of process-oriented instruments. SAWATEC has developed appropriate configurations for standard process steps.
Due to its modular, flexible design with an automatic central load station, the cluster system allows the customer to implement individual, customer- specific solutions in the production (Challenger series).
The cluster system CS-200-4 sirius is in the first station with a spin module SM-200-CS, in the second station with a developer SMD-200-CS or SMD-200-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.
Depending on the process flow and capacity requirements more hotplates can be integrated.
FEATURES (BASIC CONFIGURATION)
For more details or the documentation please contact our Sales Team via contact form.
The cluster system CS-200-4 pioneer is in the first station with a spray coater iSPRAY-200-CS, in the second station with a developer SMD-200-CS or SMD-200-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.
Depending on the process flow and capacity requirements more hotplates can be integrated.
FEATURES (BASIC CONFIGURATION)
For more details or the documentation please contact our Sales Team via contact form.
The cluster system CS-300-4 explorer is in the first station with a spin module SM-300-CS, in the second station with a developer SMD-300-CS or SMD-300-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.
Depending on the process flow and capacity requirements more hotplates can be integrated.
FEATURES (BASIC CONFIGURATION)
For more details or the documentation please contact our Sales Team via contact form.
The cluster system CS-300-4 orbiter is in the first station with a spray coater iSPRAY-300-CS, in the second station with a developer SMD-300-CS or SMD-300-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.
Depending on the process flow and capacity requirements more hotplates can be integrated.
FEATURES (BASIC CONFIGURATION)
OPTIMUM SELECTION FOR PERFECT COATING RESULTS
The spin chuck range by SAWATEC offers an optimum selection for all substrate sizes and materials to switch seamlessly from one spin chuck size and design to the next. To ensure that the reverse side of the substrate does not become contaminated, it is crucial to select the optimum spin chuck size and specific chuck design.
Replacing the spin chucks is very easy and does not require any tools. Depending on the application, one-piece or two-piece, vacuum or mechanical spin chucks with optical centring aid are used.
TWO-PIECE SPIN CHUCK
SAWATEC developed an innovative two-piece spin chuck which offers great benefits. The new design reduces effectively costs for the capability of handling multiple substrate dimensions. The chuck holder made in Aluminium can be combined with a wide range of different plastic spin chucks. Less space is required to store a full set of different chuck sizes which is essential for work conditions where the space to operate is very limited (especially in Gloveboxes and other Cabinet applications).
Based on commonly used spin chuck sizes SAWATEC created a Spin Chuck Set, which contains different spin chuck sizes starting from specimen 8“, 1“, 2“, 4“, and 6“ vacuum chucks.
The chuck holder is an integrated part of the Spin Module SM-150. The Spin Chuck Set is designed for our Spin Module SM-150 but can principally also be used for larger instruments.
The set includes different spin chuck sizes starting from specimen 8“, 1“, 2“, 4“, and 6“ vacuum chucks.
For more details or the documentation please contact our Sales Team via contact form.
The SAWATEC Spin Modules are the optimal choice for manual or semi-automatic coating of thin layers. The cleanliness of the process chamber is very important to achieve good coating results. It is therefore advisable to clean the spin coater immediately after each use (cleaning instructions in accordance with the operating instructions). There are some places, which are often too little considered or need a little more cleaning effort (e. g., suction and media discharge in the process bowl, chuck receptacle, lid).
In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a good value bowl protection insert. This bowl protection insert is easy to remove and dispose of once the process has been completed.
Advantages
The dosing pumps by SAWATEC feature a wide range of media viscosities, coupled with a high-precision delivery volume.
The application of hard-wearing, inert materials results in an excellent chemical compatibility with the most diverse fluids. Due to the compact, space-saving design, easy flushing and cleaning, long lifetime and low-cost maintenance, the pumps are not only used in our own instruments and systems, but also preferentially by a variety of OEM customers.
The different dosing pumps can be used for a wide range of applications and are ideally suited for use in the semiconductor industry, in the field of MEMS, in medical technology, in the chemical/pharmaceutical industry, in bottling plants and in analytical and laboratory apparatus.
The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.
For more details or the documentation please contact our Sales Team via contact form.
The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.
For more details or the documentation please contact our Sales Team via contact form.
The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.
For more details or the documentation please contact our Sales Team via contact form.
The precision pumps GSP-98-ML and GSP-98 are ideal for applications requiring high-precision dosing amounts. Due to their innovative design with integrated valve control, these pumps do not require any additional external valves. The medium is not stressed because it does not control the pump. Therefore, no gas bubbles form.
GSP-98-ML
PUMP CONTROLLER GSP II
For more details or the documentation please contact our Sales Team via contact form.
The precision pumps GSP-98-ML and GSP-98 are ideal for applications requiring high-precision dosing amounts. Due to their innovative design with integrated valve control, these pumps do not require any additional external valves. The medium is not stressed because it does not control the pump. Therefore, no gas bubbles form.
GSP-98
PUMP CONTROLLER GSP II
For more details or the documentation please contact our Sales Team via contact form.
The diaphragm dosing valve DV-257rounder among the diaphragm dosing valves. It is perfectly suited for any type of media with low to medium viscosity and explosion-proof processes.
In addition, SAWATEC‘s product range includes further application-based valves.
A wide viscosity range, coupled with space-saving designs, a long life cycle thanks to hard-wearing materials, very easy cleaning and inexpensive maintenance distinguish all SAWATEC dosing valves.
