Product range along the processing steps
Our wide range of application-oriented instruments, systems and components is used for various processing steps along the entire process chain, offering versatile customer benefit.

For special customer requirements we also developed custom-made products which transgress into the physical and technical limits and move today’s process boundaries constantly new.

Instruments

Hotplates: Our HP series

SAWATEC supplies various hotplates for typical soft bake and hard bake processes in lithography, MEMS and similar applications. Outstanding features of the manual hotplates are their robust design and ease of operation. The extensive HP series can be used for wafers up to 300mm or 12×12 inch substrates.

These instruments are available as portable bench-top, bench-mounted or mobile cabinet units.

Hotplate HP-150

The Hotplate HP-150 was developed for typical soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250°C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 150mm and thicknesses of 5mm at maximum.

The hotplate is covered with safety glass, which makes cleaning easier. Due to the highquality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision, good value instruments are available both as portable bench-top and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Automatic temperature limit switch, no overheating
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing manually controlled, no oxidation
  • Simple setup tool for optimal alignment of the hotplate

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 1°C at 100°C

 

Offer/Documentation

Hotplate HP-200

The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250°C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200mm and thicknesses of 18mm at maximum.

The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality and robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision instruments are available as portable bench-top, bench-mounted or mobile cabinet units.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Quick start function for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 20 program-steps
  • Proximity as well as loading pins, can be easily adapted to different substrate sizes
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • User-friendly process configuration with touch screen panel
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Simple setup tool for optimal alignment of the hotplate

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 0.6°C at 100°C
  • Electrical driven proximity and loading pins (stroke 8mm)
  • Program controlled adjustable proximity pins (0.1mm increments)

 

Offer/Documentation

Hotplate HP-200-Z

The Hotplate HP-200-Z was developed for ultra-high precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 300°C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200mm and thicknesses of 18mm at maximum.

The multi-zone heating system ensures very high temperature distribution, which is adjustable for each zone. The hotplate also has a vacuum chamber and can be used as standard for bonding agent applications. The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality, robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision instruments are available both as mobile cabinet and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Quick start function for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 20 program-steps
  • Free programmable heating curve with max. 10°C/min (25°-300°C)
  • Free programmable cooling curve with max. 5°C/min (300°-40°C)
  • Hotplate with multi-zone heating (9 zones) and with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • User-friendly process configuration with touch screen panel
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates
  • N2 flushing manually controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion

ADDITIONAL FUNCTIONS (OPTIONS)

  • Simple setup tool for optimal alignment of the hotplate

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 300°C
  • Temperature accuracy: +/- 0.3°C at 100°C

 

Offer/Documentation

Hotplate HP-300-Z

The Hotplate HP-300-Z was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 300°C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 300mm and thicknesses of 20mm at maximum. The hotplate comes as standard with proximity and loading pins, allowing simultaneous processing of five substrates (up to 100mm).

The multi-zone heating system ensures very high temperature distribution, which is adjustable for each zone. The hotplate is covered with safety glass, which makes cleaning easier. Due to the high quality, robust design and easy handling, SAWATEC hotplates are preferentially used for laboratories, R&D, pilot projects and institutes.

The high-precision instrument is available as mobile cabinet unit.

FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Quick start function for repeat processes
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 20 program-steps
  • Proximity as well as loading pins, can be easily adapted to different substrate sizes
  • Free programmable heating curve with max. 10°C/min (25°-300°C)
  • Free programmable cooling curve with max. 5°C/min (300°-40°C)
  • Hotplate with multi-zone heating (16 zones) and with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • User-friendly process configuration with touch screen panel
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Simple setup tool for optimal alignment of the hotplate

 

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 300°C
  • Temperature accuracy: +/- 0.5°C at 100°C
  • Electrical driven proximity and loading pins (stroke 8mm)
  • Program controlled adjustable proximity pins (0.1mm increments)

 

Offer/Documentation

Spin Modules: Our SM series

The manual spin modules by SAWATEC are used for substrates with no or very low surface structures. The user-friendly operation and large range of application-specific chucks facilitate a high degree of flexibility in terms of the substrates that can be used. All commercial photoresists can be coated homogeneously on wafers up to 300mm or 9×9 inch substrates.

The SM series is convincing due to its high level of uniformity and repeatability, coupled with easy operation and comfortable handling. In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a comprehensive and good value bowl protector. This bowl protector is easy to remove and dispose of once the process has been completed. Due to the high-quality design, the maintenance effort is minimal. Therefore, the SAWATEC spin modules are preferentially used for laboratories, R&D, pilot projects and institutes.

The compact SM series is supplied as portable bench-top, bench-mounted or mobile cabinet units.

Spin Module SM-150

The Spin Modules SM-150 are the optimal choice for manual and semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 150mm  (6 inches) or 127x127mm (5×5 inch) substrates. The process chamber is designed for a diameter of up to 176mm.

The high-precision, good value instruments are available both as portable bench-top and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Manual cover with air flow inlet and sensor lock control
  • Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Semi-automatic cartridge dispensing system, 50ml glass syringe with manual dispensing arm and recirculation function
  • Manual nitrogen (N2) purge of the process chamber
  • Start/stop foot switch for ease of operation (cable length 1.8m)
  • Bowl assembly made of anodised aluminium or stainless steel
  • Bowl protector made of aluminium or PE
  • Vacuum pump for SM-150 module
  • Wafer alignment tool 1” – 6” (round)

 

PERFORMANCE DATA

      • Speed range: 0 to 10’000rpm +/-1rpm
      • Speed acceleration: 0 – 8’000rpm in 0,8 sec. / 0 – 10’000rpm in 1 sec. 1)
      • Delay: 10’000rpm – 0 in 2,5 sec. / 8’000 rpm – 0 in 0,8 sec. 1)
      • Process time up to 2376 seconds
      • Dosing time 99 seconds/segment

1) Depending on the substrate size and spin chuck type

 

Offer/Documentation

Spin Module SM-200

The Spin Modules SM-200 are the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 200mm (8 inches) or 150x150mm (6×6 inch) substrates.

The RCCT system (Round-Closed-Chamber-Technology) effectively reducing air turbulence over the rotating substrate and improve the coating uniformity as the atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and results in a more homogeneous coating process with remarkably savings of the consumed medias.

The high-precision instruments are available both as mobile cabinet and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • RCCT system (Round-Closed-Chamber-Technology)
  • Dynamic dispense arm prepared for up to 4 media lines
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Automatic cartridge dispensing system, 50ml glass syringe CDS-50
  • Top side edge bead removal (EBR circular, EBR circular and linear)
  • Automatic nozzle cleaning including solvent pump FP-20
  • Additional dispensing line including precision dosing pump GSP-98
  • Start/stop foot switch for ease of operation (cable length 1.8m)
  • Bowl protector made of PR or aluminium
  • Wafer alignment tool 2” – 8” (round)

 

PERFORMANCE DATA

  • Speed range: 1 to 6’000rpm +/-1rpm (optional 10’000rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value <+/-1%
  • Speed acceleration: 0 – 6’000rpm in 0,6 sec.
  • Delay: 6’000 rpm – 0 in 0,6 sec.
  • Process time up to 9’999 seconds with 0,1 sec. steps
  • Dosing time 999 seconds/segment

 

Offer/Documentation

Spray Coaters: Our iSPRAY series

For substrates with a highly structured wafer topography, deep MEMS structures or a non-planar surface texture, the iSPRAY-300 by SAWATEC ensures that the coating is as homogeneous as possible. It is a high-precision spray coater for manual spray coating or spray development processes and it is used specifically in research and development laboratories, for pilot productions and small production units in MEMS fabrication.

Accessories
The standard spray coating method in the direction of X and Y can additionally be combined with a rotating spin chuck (with or without heating), which improves the distribution of the photoresist for certain topographies and increases the diversity of the coating.

Furthermore, the iSPRAY-300 can be equipped with a hotplate. With this, even photoresists with a higher viscosity can be processed with little accumulation in cavities and reliable coating of the edges.

Spray Coater iSPRAY-300

In conjunction with low-viscosity photoresists (e.g. Shipley 1813, AZ 4999, AZ 9260, SU8 etc.)
that are particularly suited for spray coating, the process-optimised spray nozzle generates
extremely fine droplets. Spray coating takes place by means of a loop-shaped spray pattern in a
closed process chamber, thus ensuring uniform coating across the entire substrate surface and
a high level of repeatability. Both round and square substrates, up to 4 wafers at a time, can be
coated.

The iSPRAY-300 spray coater is designed for wafers with a maximum diameter of 300mm or for
12×12 inch substrates.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: spray pattern, spray arm speed, spray time, spray beam cone
  • Electrically operated spray arm with selectable speed in the direction of the x-axis and the y-axis
  • Adjustable spray nozzle with constant nozzle pressure and automatic cleaning function
  • Control elements for dispensing compressed air and vacuum
  • Manual loading and unloading of the substrates
  • Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Hotplate up to 150°C, usable heating surface Ø300mm
  • Spin chuck with up to 1’500rpm +/-1rpm 1)
  • Heatable spin chuck with up to 1,500rpm and a maximum of 150°C
  • Z-lift-axis for spray nozzle
  • Two spray nozzles with separate photoresist feeds to prevent contamination

1) Depending on the substrate size

 

PERFORMANCE DATA

  • Spray volume: 50 cl in buffer cartridge, supply pump with level control
  • Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
  • Spray nozzle: droplet size < 7 micron, type Micro 3
  • Speed and position accuracy of the spray arm: max. 0.4 m/s; ±0.1mm
  • Spray time per segment: max. 9999 seconds with 0.1 second increments
  • Number of spray cycles: max. 20 meanders
  • Ambient temperature: +4°C to +60°C

 

Offer/Documentation

Developers: Our SMD series

The development of the exposed photoresist is one of the most critical process steps, therefore special care need to be given to the selection of the development process and its parameters (temperature, development time, etc.). The SAWATEC developers can be used for puddle or spray development, in which the optimum process being chosen based on application-technical and economic criteria.

Each substrate is individually developed respectively etched in the spray development and the exposed areas are continuously sprayed with fresh developing or etching agent to prevent that the developer getting saturated. The advantage of the spray development compared to the puddle development is that very small structures can be released and a significantly lower developer solution respectively etching agent is required.

The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are ideally suited for laboratories, R&D, institutes and pilot projects.

The instrument is available as bench-mounted or mobile cabinet unit.

Developer SMD-200

They are designed to clean and to develop wafers up to 8” or substrates up to 6” x6 ” (150 x 150mm). The process-chamber works up to Ø 212mm.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed (rpm), acceleration, time (sec.), spray-time developer(sec.), speed of spray arm, rins and N2 drying
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included (up to 4 developer lines possible)
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Control elements for compressed air and vacuum for dispensing included
  • Closed process chamber for process safety
  • Manual loading and unloading of the substrates
  • Mechanical substrate fixation
  • Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional developer line
  • Developer tank heating system (2 ltr.)
  • Spray nozzle made of PEEK (0,3 / 0,5mm)

 

PERFORMANCE DATA

  • Speed range: 0 bis 3’000rpm +/-1rpm 1)
  • Speed acceleration: 0 – 5’000rpm in 0.5 sec. 1)
  • Process time up to 2376 seconds
  • Spray time-developer 99 seconds/segment
  • Speed spray arm (mm/seconds)
  • Rins and N2-drying 99 seconds/segment
  • Heatable process hood up to 50°C
  • Spray nozzle made from PEEK 0,8mm

1) Slower speed and acceleration for the process recommended

 

Offer/Documentation

Developer SMD-200-E

They are designed to clean and to etch wafers up to 8” or substrates up to 6” x6 ” (150 x 150mm). The process-chamber works up to Ø 212mm.

FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameter: speed (rpm), acceleration, time (sec.), spray-time developer(sec.), speed of spray arm, rins and N2 drying
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included (up to 4 developer lines possible)
  • Nozzle for DI-water-rinse and N2 drying on the spray arm
  • Control elements for compressed air and vacuum for dispensing included
  • Closed process chamber for process safety
  • Manual loading and unloading of the substrates
  • Mechanical substrate fixation
  • Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Additional developer line
  • Developer tank heating system (2 ltr.)
  • Spray nozzle made of stainless steel (0,3 / 0,5mm)

PERFORMANCE DATA

  • Speed range: 0 bis 3’000rpm +/-1rpm 1)
  • Speed acceleration: 0 – 5’000rpm in 0.5 sec. 1)
  • Process time up to 2376 seconds
  • Spray time-developer 99 seconds/segment
  • Speed spray arm (mm/seconds)
  • Rins and N2-drying 99 seconds/segment
  • Heatable process hood up to 50°C
  • Spray nozzle made of stainless steel 0,8mm

1) Slower speed and acceleration for the process recommended

 

Offer/Documentation

Spin Rinser Dryers: Our SRD series

The spin rinser dryers of the SRD series can be used to rinse assembled wafer cassettes following wet-chemical processes and effciently dried by means of centrifugal force and heated nitrogen. The SAWATEC spin rinser dryers are equipped with closed stainless steel process chambers and integrated imbalance compensation.

The SRD-series is characterized by its excellent process quality and high productivity coupled with easy handling. They can be used for wafers measuring 50mm to 200mm, with a maximum load capacity of 4 wafer cassettes, each containing 25 wafers.

These instruments are available as a cabinet, double-decker or as an integral part of wet-chemical systems.

Spin Rinser Dryer SRD-150-4S

The SAWATEC Spin Rinser Dryer SRD-150-4S is easy to operate and to handle. The instrument is available as mobile cabinet or integrated part of wet-chemistry systems. The wafers or substrates can be rinsed by a cooling and drying centrifuge according to processes of wet-chemistry and they can be dryed by centrifugal force and heated nitrogen.

The process chamber respectively the cassette rotor is designed for a substrate diameter of 150mm.

FEATURES (BASIC CONFIGURATION)

  • Max. loading capacity of 4 wafer cassettes each with 25 slots
  • Innovative cassette holder, adjustable for 3 different cassette sizes without any tools
  • Process controller with touch-panel monochrom
  • Process parameters: speed (rpm), rins and N2 dry time (sec.), temperatur N2 rinse, temperature process chamber
  • Quick start function for repeat processes
  • Up to 10 programmes with 20 segments each can be programmed
  • Closed process chamber and rotor made of stainless steel electropolished
  • Pneumatic driven cover with two hand operation
  • Manual loading and unloading of the cassettes
  • Cassettes fixation mechanically with side holder
  • Acoustic and optical signal when process has finished

 

ADDITIONAL FUNCTIONS (OPTIONS)

  • Rotor for masks-application
  • Cassette sizes from 2” to 6”
  • Masks on request

 

PERFORMANCE DATA

  • Speed: 1’400rpm +/-1rpm
  • Rins time: 99 seconds/segments
  • N2 dry time: 99 seconds/segments
  • Temperature N2-rinse (DI-water): 80-100°C
  • Temperature process chamer: 70°C
  • Automatic imbalance compensation: up to 100gr. imbalance

 

Offer/Documentation

Spin Rinser Dryer SRD-200

The SAWATEC Spin Rinser Dryer SRD-200 is easy to operate and to handle. The instrument is available as a stand-alone device or double-decker version. The wafers or substrates can be rinsed by a cooling and drying centrifuge according to processes of wet-chemistry and they can be dryed by centrifugal force and heated nitrogen.

The process chamber respectively the cassette rotor is designed for a substrate diameter of 200mm.

FEATURES (BASIC CONFIGURATION)

  • Loading capacity of 1 wafer cassette with 25 slots
  • Easy exchange between 150mm and 200mm cassettes without any tools
  • Process controller with touch screen panel
  • Process parameters: speed (rpm), rins and N2 dry time (sec.), DI rinse, temperature process chamber
  • Quick start function for repeat processes
  • Up to 50 programmes with 24 segments each can be programmed
  • Closed process chamber and rotor made of stainless steel electropolished
  • Manual door with controlled door seal and safety switch (left / right fitting easily replaceable)
  • N2- and DI-water heating
  • Manual loading and unloading of the cassettes
  • Cassettes fixation mechanically with side holder
  • Acoustic signal when process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

  • Conductivity
  • Antistatic device
  • Control device for nitrogen
  • CO2-purging
  • DI-water resistance monitoring enables flushing to a certain resistance
  • Undercarriage

 

PERFORMANCE DATA

  • Speed: 2’000rpm +/-1rpm (depending on substrate size)
  • Rins time: 99 seconds/segments
  • N2 dry time: 99 seconds/segments
  • Temperature N2-rinse (DI-water): 80-100°C
  • Temperature process chamer: 70°C
  • Automatic imbalance compensation: up to 100gr. imbalance

 

SRD Poster

 

Offer/Documentation

Systems

Combined Systems: Our duo series

The SAWATEC combined systems connect spin modules or developers with the hotplate series in one compact cabinet. The Duo series is convincing due to its robust design and flexible combination possibilities of the high-quality SAWATEC instruments, even for different substrate sizes.

The combined systems are particular suitable for laboratories, R&D, institutes and pilot projects; they are available as mobile cabinet units.

SM-200/HP-200 duo

The Spin Modules SM-200 are the optimal choice for manual and semi-automatic coating of thin layers. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 200mm (8 inches) or 150x150mm (6×6 inch) substrates.

The Hotplate HP-200 was developed for typical soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250°C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200mm and thicknesses of 18mm at maximum.

Spin Module SM-200 FEATURES (BASIC CONFIGURATION)

  • Up to 50 programmes with 24 segments each can be programmed
  • Quick start function for repeat processes
  • User-friendly process configuration with touch screen panel
  • Process parameters: speed, acceleration, time
  • Rotational direction can be selected (CW, CCW)
  • RCCT system (Round-Closed-Chamber-Technology)
  • High dynamic, direct drive AC Servo spinner motor
  • Manual loading and unloading of the substrates
  • Substrate fixation via vacuum and safety interlock protection
  • Acoustic signal when the process has finished

Spin Module SM-200 ADDITIONAL FUNCTIONS (OPTIONS)

  • Automatic cartridge dispensing system, 50ml glass syringe CDS-50
  • Top side edge bead removal (circular, circular and linear)
  • Automatic nozzle cleaning
  • Additional dispensing line including pump
  • Start/stop foot switch for ease of operation (cable length 1.8m)
  • Bowl protector made of aluminium or PE
  • Wafer alignment tool 2” – 8” (round)

Hotplate HP-200 FEATURES (BASIC CONFIGURATION)

  • Temperature control with digital target and actual value display
  • Automatic temperature limit switch, no overheating
  • Heating ramp up possible with 20 program-steps
  • Hotplate with safety glass, easy cleaning
  • Easy levelling of the hotplate, prevents discharge of photoresist
  • Pneumatic lift of the lid
  • Pin made of Inconell with ceramic ball
  • Manual substrate fixation via vacuum
  • Manual loading and unloading of the substrates

Hotplate HP-200 ADDITIONAL FUNCTIONS (OPTIONS)

  • N2 flushing program controlled, no oxidation
  • HMDS priming program controlled, optimized adhesion
  • Proximity as well as loading pins
  • Simple setup tool for optimal alignment of the hotplate

 

Spin Module SM-200 PERFORMANCE DATA

  • Speed range: 1 to 6’000rpm +/-1rpm (optional 10’000)
  • Difference from set rotation speed to actual value <+/-1%
  • Motor acceleration ramp: 50’000rpm/s2; without wafer
  • Recipe spin time: 9’999sec. with 0,1 sec. steps
  • Process bowl made of PETP for wafers up to 200mm and 150x150mm

Hotplate HP-200 PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250°C
  • Temperature accuracy: +/- 1°C at 100°C
  • Pneumatic driven pins (stroke 8mm)
  • Pin circle diameter Ø 45mm

 

Offer/Documentation

Cluster Systems: Our CS series

The SAWATEC cluster systems are the perfect solution for customers looking for fully automatic cassette-to-cassette applications. The modular CS series is comprised of an optical prealigner station and three flexible stations, which can be equipped with a number of process-oriented instruments. SAWATEC has developed appropriate configurations for standard process steps.

Due to its modular, flexible design with an automatic central load station, the cluster system allows the customer to implement individual, customer- specific solutions in the production (Challenger series).

CS-200-4 pioneer

The cluster system CS-200-4 pioneer is in the first station with a spray coater iSPRAY-200, in the second station with a developer SMD 200 or SMD-200-E (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High productivity and output, low maintenance cost, quick amortisation
  • Reliable process instruments, service-friendly and low downtime
  • Substrate sizes up to 200mm (8”)
  • Flexible process module configurations with Linux operating system
  • Easy to control with 15” touch screen panel
  • Automatic wafer detection in the cassette
  • Compact design and minimized space requirements
  • Easy to clean

Spray Coater iSPRAY-200 FEATURES (BASIC CONFIGURATION)

  • Process parameters: spray pattern, spray arm speed, spray time, spray beam cone
  • Electrically operated spray arm with selectable speed in the direction of the x-axis, y-axis and the z-axis
  • Spray volume: 50 cl in buffer cartridge, supply pump with level control
  • Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
  • Spray nozzle: droplet size < 7 micron, type Micro 3
  • Speed and position accuracy of the spray arm: max. 0.4 m/s; ±0.1mm
  • 2 media nozzle technology (PR and N2) with variable beam cone
  • Adjustable spray nozzle with constant nozzle pressure and automatic cleaning function
  • Control elements for dispensing compressed air and vacuum

Developer SMD-200 / SMD-200-E FEATURES (BASIC CONFIGURATION)

  • Closed process chamber for process safety, made of PP (SMD) or stainless steel (SMD-E)
  • Bowl assembly is capable up to 200mm, heatable process hood up to 50°C
  • Spin speed maximum up to 3’000rpm +/-1rpm (depending on substrate size and weight)
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included
  • Nozzle for DI-water rinse and N2 drying on the supply-arm
  • Mechanical substrate fixation, various mechanical spin chucks

Hotplates HP-200 / Coolplate CP-200 FEATURES (BASIC CONFIGURATION)

  • Maximum hotplate temperature 250°C (temp. uniformity of +/-0.5°C at 100 °C)
  • Automatic temperature limit switch, no overheating
  • Hot- and Coolplate surface diameter 250mm, suitable for 8” substrate
  • Programmable proximity and loading and unloading pins (8mm stroke)
  • Proximity pins with fine adjustment steps of 0.1mm
  • Substrate fixation with vacuum
  • Easy manual levelling of the Hot- and Coolplate, prevents discharge of photoresist

ADDITIONAL FUNCTIONS (OPTIONS)

  • Paddle station for various substrates sizes
  • Flip station to turn the substrate (back coating)

Cabinet Design

  • Stainless steel cabinet designed for clean room applications
  • All around transparent doors for process observation
  • Central positioned 3-axis field approved high speed robot with smart end effector
  • Optical pre-alignment station
  • All modules easy to reach for maintenance and service
  • Carrier station (2 carriers) with universal design adaption for different cassette types
  • Exhaust control manually for each module
  • Process control light green, orange and red

Required Media

  • Voltage: 3×400 VAC (380 VAC) Ph 0 50/60Hz 32A
  • Vacuum: -0.8 bar +/-0.2 bar, Tube Ø 8/6 mm
  • CDA: 6 bar, Tube Ø 8/6 mm
  • Nitrogen: 4 bar, Tube Ø 8/6 mm
  • DI-water: 1-2 bar, Tube Ø 8/6 mm
  • Cooling water: 2 pcs. chiller IN / OUT, Ø 8/6 mm
  • Exhaust: 3 pcs. Ø 150 mm (80-120m3/h)

Offer/Documentation

CS-200-4 sirius

The cluster system CS-200-4 sirius is in the first station with a spin module SM-200, in the second station with a developer SMD 200 or SMD-200-E (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High productivity and output, low maintenance cost, quick amortisation
  • Reliable process instruments, service-friendly and low downtime
  • Substrate sizes up to 200mm (8”)
  • Flexible process module configurations with Linux operating system
  • Easy to control with 15” touch screen panel
  • Automatic wafer detection in the cassette
  • Compact design and minimized space requirements
  • Easy to clean

Spin Module SM-200 FEATURES (BASIC CONFIGURATION)

  • Closed process chamber made of PETP (bowl and splash ring)
  • RCCT System (Round-Closed-Chamber-Technology)
  • Coating function with automatic position stop on coating edge (camera system)
  • Substrate fixation via vacuum and safety interlock protection
  • High dynamic, direct drive AC servo spinner motor
  • Spin speed up to 6’000rpm +/-1rpm (optional 10’000)
  • Programmable electrical driven dispense arm for static or dynamic dispense
  • One dispense arm with 1 media line (up to 4 media lines possible)
  • Electrical driven SAWATEC precision dosing pump GSP-98 up. to 3000 cps
  • Media supply by tanks including low level solutions
  • Drain tank made of PP with overflow sensor
  • Equipped with one set of vacuum spin chuck for 200mm (8”) substrates

Developer SMD-200 / SMD-200-E FEATURES (BASIC CONFIGURATION)

  • Closed process chamber for process safety, made of PP (SMD) or stainless steel (SMD-E)
  • Bowl assembly is capable up to 200mm, heatable process hood up to 50°C
  • Spin speed maximum up to 3’000rpm +/-1rpm (depending on substrate size and weight)
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included
  • Nozzle for DI-water rinse and N2 drying on the supply-arm
  • Mechanical substrate fixation, various mechanical spin chucks

Hotplates HP-200 / Coolplate CP-200 FEATURES (BASIC CONFIGURATION)

  • Maximum hotplate temperature 250°C (temp. uniformity of +/-0.5°C at 100 °C)
  • Automatic temperature limit switch, no overheating
  • Hot- and Coolplate surface diameter 250mm, suitable for 8” substrate
  • Programmable proximity and loading and unloading pins (8mm stroke)
  • Proximity pins with fine adjustment steps of 0.1mm
  • Substrate fixation with vacuum
  • Easy manual levelling of the Hot- and Coolplate, prevents discharge of photoresist

ADDITIONAL FUNCTIONS (OPTIONS)

  • Paddle station for various substrates sizes
  • Flip station to turn the substrate (back coating)

Cabinet Design

  • Stainless steel cabinet designed for clean room applications
  • All around transparent doors for process observation
  • Central positioned 3-axis field approved high speed robot with smart end effector
  • Optical pre-alignment station
  • All modules easy to reach for maintenance and service
  • Carrier station (2 carriers) with universal design adaption for different cassette types
  • Exhaust control manually for each module
  • Process control light green, orange and red

Required Media

  • Voltage: 3×400 VAC (380 VAC) Ph 0 50/60Hz 32A
  • Vacuum: -0.8 bar +/-0.2 bar, Tube Ø 8/6 mm
  • CDA: 6 bar, Tube Ø 8/6 mm
  • Nitrogen: 4 bar, Tube Ø 8/6 mm
  • DI-water: 1-2 bar, Tube Ø 8/6 mm
  • Cooling water: 2 pcs. chiller IN / OUT, Ø 8/6 mm
  • Exhaust: 3 pcs. Ø 150 mm (80-120m3/h)

Offer/Documentation

CS-300-4 explorer

The cluster system CS-300-4 explorer is in the first station with a spin module SM-300, in the second station with a developer SMD 300 or SMD-300-E (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High productivity and output, low maintenance cost, quick amortisation
  • Reliable process instruments, service-friendly and low downtime
  • Substrate sizes up to 300mm (12”)
  • Flexible process module configurations with Linux operating system
  • Easy to control with 15” touch screen panel
  • Automatic wafer detection in the cassette
  • Compact design and minimized space requirements
  • Easy to clean

Spin Module SM-300 FEATURES (BASIC CONFIGURATION)

  • Closed process chamber made of PETP (bowl and splash ring)
  • RCCT System (Round-Closed-Chamber-Technology)
  • Coating function with automatic position stop on coating edge (camera system)
  • Substrate fixation via vacuum and safety interlock protection
  • High dynamic, direct drive AC servo spinner motor
  • Spin speed up to 6’000rpm +/-1rpm (optional 10’000)
  • Programmable electrical driven dispense arm for static or dynamic dispense
  • One dispense arm with 1 media line (up to 4 media lines possible)
  • Electrical driven SAWATEC precision dosing pump GSP-98 up. to 3000 cps
  • Media supply by tanks including low level solutions
  • Drain tank made of PP with overflow sensor
  • Equipped with one set of vacuum spin chuck for 300mm (12”) substrates

Developer SMD-300 / SMD-300-E FEATURES (BASIC CONFIGURATION)

  • Closed process chamber for process safety, made of PP (SMD) or stainless steel (SMD-E)
  • Bowl assembly is capable up to 300mm, heatable process hood up to 50°C
  • Spin speed maximum up to 3’000rpm +/-1rpm (depending on substrate size and weight)
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included
  • Nozzle for DI-water rinse and N2 drying on the supply-arm
  • Mechanical substrate fixation, various mechanical spin chucks

Hotplates HP-300 / Coolplate CP-300 FEATURES (BASIC CONFIGURATION)

  • Maximum hotplate temperature 250°C (temp. uniformity of +/-0.5°C at 100 °C)
  • Automatic temperature limit switch, no overheating
  • Hot- and Coolplate surface diameter 350mm, suitable for 12” substrate
  • Programmable proximity and loading and unloading pins (8mm stroke)
  • Proximity pins with fine adjustment steps of 0.1mm
  • Substrate fixation with vacuum
  • Easy manual levelling of the Hot- and Coolplate, prevents discharge of photoresist

ADDITIONAL FUNCTIONS (OPTIONS)

  • Paddle station for various substrates sizes
  • Flip station to turn the substrate (back coating)

Cabinet Design

  • Stainless steel cabinet designed for clean room applications
  • All around transparent doors for process observation
  • Central positioned 3-axis field approved high speed robot with smart end effector
  • Optical pre-alignment station
  • All modules easy to reach for maintenance and service
  • Carrier station (2 carriers) with universal design adaption for different cassette types
  • Exhaust control manually for each module
  • Process control light green, orange and red

Required Media

  • Voltage: 3×400 VAC (380 VAC) Ph 0 50/60Hz 32A
  • Vacuum: -0.8 bar +/-0.2 bar, Tube Ø 8/6 mm
  • CDA: 6 bar, Tube Ø 8/6 mm
  • Nitrogen: 4 bar, Tube Ø 8/6 mm
  • DI-water: 1-2 bar, Tube Ø 8/6 mm
  • Cooling water: 2 pcs. chiller IN / OUT, Ø 8/6 mm
  • Exhaust: 3 pcs. Ø 150 mm (80-120m3/h)

Offer/Documentation

CS-300-4 orbiter

The cluster system CS-300-4 orbiter is in the first station with a spray coater iSPRAY-300, in the second station with a developer SMD 300 or SMD-300-E (etching) and in the third station with 3 stacked hotplates and one coolplate equipped.

Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  • High productivity and output, low maintenance cost, quick amortisation
  • Reliable process instruments, service-friendly and low downtime
  • Substrate sizes up to 300mm (12”)
  • Flexible process module configurations with Linux operating system
  • Easy to control with 15” touch screen panel
  • Automatic wafer detection in the cassette
  • Compact design and minimized space requirements
  • Easy to clean

Spray Coater iSPRAY-300 FEATURES (BASIC CONFIGURATION)

  • Process parameters: spray pattern, spray arm speed, spray time, spray beam cone
  • Electrically operated spray arm with selectable speed in the direction of the x-axis, y-axis and the z-axis
  • Spray volume: 50 cl in buffer cartridge, supply pump with level control
  • Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
  • Spray nozzle: droplet size < 7 micron, type Micro 3
  • Speed and position accuracy of the spray arm: max. 0.4 m/s; ±0.1mm
  • 2 media nozzle technology (PR and N2) with variable beam cone
  • Adjustable spray nozzle with constant nozzle pressure and automatic cleaning function
  • Control elements for dispensing compressed air and vacuum

Developer SMD-300 / SMD-300-E FEATURES (BASIC CONFIGURATION)

  • Closed process chamber for process safety, made of PP (SMD) or stainless steel (SMD-E)
  • Bowl assembly is capable up to 300mm, heatable process hood up to 50°C
  • Spin speed maximum up to 3’000rpm +/-1rpm (depending on substrate size and weight)
  • Electrical driven spray arm, with dynamic or static function
  • Developer line and media tank for one developer included
  • Nozzle for DI-water rinse and N2 drying on the supply-arm
  • Mechanical substrate fixation, various mechanical spin chucks

Hotplates HP-300 / Coolplate CP-300 FEATURES (BASIC CONFIGURATION)

  • Maximum hotplate temperature 250°C (temp. uniformity of +/-0.5°C at 100 °C)
  • Automatic temperature limit switch, no overheating
  • Hot- and Coolplate surface diameter 350mm, suitable for 12” substrate
  • Programmable proximity and loading and unloading pins (8mm stroke)
  • Proximity pins with fine adjustment steps of 0.1mm
  • Substrate fixation with vacuum
  • Easy manual levelling of the Hot- and Coolplate, prevents discharge of photoresist

ADDITIONAL FUNCTIONS (OPTIONS)

  • Paddle station for various substrates sizes
  • Flip station to turn the substrate (back coating)

Cabinet Design

  • Stainless steel cabinet designed for clean room applications
  • All around transparent doors for process observation
  • Central positioned 3-axis field approved high speed robot with smart end effector
  • Optical pre-alignment station
  • All modules easy to reach for maintenance and service
  • Carrier station (2 carriers) with universal design adaption for different cassette types
  • Exhaust control manually for each module
  • Process control light green, orange and red

Required Media

  • Voltage: 3×400 VAC (380 VAC) Ph 0 50/60Hz 32A
  • Vacuum: -0.8 bar +/-0.2 bar, Tube Ø 8/6 mm
  • CDA: 6 bar, Tube Ø 8/6 mm
  • Nitrogen: 4 bar, Tube Ø 8/6 mm
  • DI-water: 1-2 bar, Tube Ø 8/6 mm
  • Cooling water: 2 pcs. chiller IN / OUT, Ø 8/6 mm
  • Exhaust: 3 pcs. Ø 150 mm (80-120m3/h)

Offer/Documentation

Components

Spin Chuck Range

The spin chuck range by SAWATEC offers the right selection for all Substrate sizes and substrate materials.

For perfect coating results, the spin chucks are supplied in different sizes, materials and designs. Depending on the application, one-piece or two-piece spin chuck sets with optical centring aid are used.

To ensure that the reverse side of the substrate does not become contaminated, it is the crucial to select the optimal spin chuck size and specific chuck design. Replacing the spin chucks is very easy and does not require any tools.

For proper operation of the spin modules and to achieve a high uniformity, it is important that only original Sawatec spin chucks are used. When using foreign brand spin chucks we cannot accept any liability with respect to the given specifications and process safety.

chuckteller_2_bilder

Bowl protector

In order to keep the cleaning effort for the spin module process chamber to a minimum, SAWATEC has developed an inexpensive bowl protector. This protective insert is easy to remove and dispose of once the process has been completed.

Bowl protector

Precision dosing pumps

The dosing pumps by SAWATEC feature a wide range of media viscosities, coupled with a high-precision delivery volume.

The application of hard-wearing, inert materials results in an excellent chemical compatibility with the most diverse fluids. Due to the compact, space-saving design, easy flushing and cleaning, long lifetime and low-cost maintenance, the pumps are not only used in our own instruments and systems, but also preferentially by a variety of OEM customers.

The different dosing pumps can be used for a wide range of applications and are ideally suited for use in the semiconductor industry, in the field of MEMS, in medical technology, in the chemical/pharmaceutical industry, in bottling plants and in analytical and laboratory apparatus.

Diaphragm dosing pumps SP-177

The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.

 

Leaflet Dosing pumps_EN

 

Offer/Documentation

Diaphragm dosing pumps SPV-15

The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.

 

Leaflet Dosing pumps_EN

 

Offer/Documentation

Diaphragm supply pump FP-20

The diaphragm dosing pumps SP-177 and SPV-15, as well as the diaphragm supply pump FP-20 are perfectly suited for applications with highly fluid and viscous media and are also approved for explosion-proof processes. All three types have a robust design, are low-maintenance and very reliable. Thanks to these properties, they are a good choice for flexible applications.

 

Leaflet Dosing pumps_EN

 

Offer/Documentation

Precision pumps GSP-98

The precision pumps GSP-98-ML and GSP-98 are ideal for applications requiring high-precision dosing amounts. Due to their innovative design with integrated valve control, these pumps do not require any additional external valves. The medium is not stressed because it does not control the pump. Therefore, no gas bubbles form.

PC_GSP_GSP-98_kombination_staender_weg_02

PUMP CONTROLLER GSP II

  • Features: Dosing, flushing, cleaning
  • 10 freely definable dosing and cleaning programmes
  • User interface via membrane keys with two-line display
  • Process parameters: Dosing, reverse, offset and suck back time
  • Controller controls the stepper motor and the magnetic valve
  • Sensor checks the initial position of the needle valve
  • Equipped with RS232 and digital I/O interface
  • Easy system integration

 

Leaflet Dosing pumps_EN

 

Offer/Documentation

Precision pumps GSP-98-ML

The precision pumps GSP-98-ML and GSP-98 are ideal for applications requiring high-precision dosing amounts. Due to their innovative design with integrated valve control, these pumps do not require any additional external valves. The medium is not stressed because it does not control the pump. Therefore, no gas bubbles form.

PC_GSP_GSP-98_kombination_staender_weg_02

PUMP CONTROLLER GSP II

  • Features: Dosing, flushing, cleaning
  • 10 freely definable dosing and cleaning programmes
  • User interface via membrane keys with two-line display
  • Process parameters: Dosing, reverse, offset and suck back time
  • Controller controls the stepper motor and the magnetic valve
  • Sensor checks the initial position of the needle valve
  • Equipped with RS232 and digital I/O interface
  • Easy system integration

 

Leaflet Dosing pumps_EN

 

Offer/Documentation

Dosing valve

The diaphragm dosing valve DV-257rounder among the diaphragm dosing valves. It is perfectly suited for any type of media with low to medium viscosity and explosion-proof processes.

DV-257

In addition, SAWATEC‘s product range includes further application-based valves.

A wide viscosity range, coupled with space-saving designs, a long life cycle thanks to hard-wearing materials, very easy cleaning and inexpensive maintenance distinguish all SAWATEC dosing valves.